Cyclone V SOM

Cyclone V SOM

iW-RainboW-G17®

  • Intel’s Cyclone V SX SoC FPGA
  • ARM Cortex A9 Dual core CPU integrated with FPGA with up to 110K LEs
  • Enhanced with integrated transceivers and hard memory controller
  • Readily available FPGA IP cores for integration
  • R2.0 Qseven compatible module
  • First ARM based Qseven SOM module with PCIe x 4 lane support
  • Industrial grade availability
  • 10+ Years Longevity
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Downloads

Documents

Design Support

Software

Specification

On Module Features:

CPU
  • Altera’s Cyclone V SX SoC FPGA
  • Integrated Dual core ARM Cortex-A9 Hard Processor System(HPS)
  • FPGA with upto 110K LEs
Memory
  • 512MB DDR3 with ECC for HPS
  • 16 MB QSPI Flash*
  • On-SOM Micro SD Connector#
  • 256MB DDR3 for FPGA
  • EPCQ flash* / QSPI Flash for FPGA
  • EEPROM*
On Board Peripherals Support:
  • JTAG Header for FPGA*
  • JTAG Header for HPS*
  • DIP Switch for boot settings
  • RTC controller

Qseven PCB Edge Connector Interfaces:

From HPS:
  • Gigabit Ethernet – 1 Port (On-SOM PHY)
  • USB 2.0 Host – 4 Ports (On-SOM HUB)
  • CAN – 1 Port
  • SD/MMC (8 bit) #
  • WDOG – 1 Port
  • I2C – 2 Ports
  • SPI – 1 Port
  • Debug UART – 1 Port
  • 2nd UART – 1 Port
  • Other Control IOs – Through HPS
From FPGA+:
  • LVDS LCD – 2 Ports (FPGA Soft IP)/ 23 SE IOs
  • AC97/I2S Audio (FPGA Soft IP)/ 5 SE IOs
  • PWM
  • FPGA IOs – 8 SE IOs
From FPGA High Speed Transceivers+:
  • SATA (FPGA Soft IP)
  • PCIe Gen1 x 4 Lane

80 Pin Expansion Connector:

  • FPGA IOs (Up to 45 Single Ended IOs – SE IOs)
  • 9 TX LVDS Pairs / 18 SE IOs
  • 11 RX LVDS Pairs / 22 SE IOs
  • 10 Single Ended IOs
  • 5 Single Ended IOs

FPGA Dedicated Clock IOs:

  • General Purpose Clock Inputs (2 LVDS/2 SE)
  • General Purpose Clock Output (1 LVDS/2 SE)

Others:

  • SMBUS / 2 SE IOs
  • FPGA JTAG

General Features:

Power Input
  • 5V through Qseven Edge
Form Factor
  • 70mm x 70mm
Operating Temperature
  • -40°C to +85°C
Environment Specification
  • RoHS & REACH Compliant

THERMAL SOLUTIONS

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Heatspreader_Front
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For any highly integrated System On Modules, thermal design is very important factor. iWave Supports Heat Sink and Heat Spreader Solution for i.MX 8M Mini/Nano µQseven SOM.

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DEVELOPMENT KIT

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  • Standard SD – 1 Port (Boot & OS Storage)
  • SATA 3.0 – 1 Port#
  • Debug Console through Micro USB
  • Data UART – 1 Port
  • CAN – 1 Port
  • USB 2.0 Host – 3 ports
  • 10/100/1000 Ethernet – 1 Port
  • PCIe x1 Slot
  • AC’97 codec- Audio IN/OUT Jacks
  • LVDS – 2 Port
  • Operating Temperature: 0°C to +60°C
  • Form Factor : Nano-ITX (120mmX120mm)
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