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Design Support

Software

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Kintex UltraScale+ FPGA SOM

Kintex UltraScale+ FPGA SOM

iW-RainboW-G47M®

  • Xilinx Kintex UltraScale+ FPGA with B2104 package
  • Compatible with KU19P, KU095, KU115 FPGA
  • Dual 4GB FPGA-DDR4 with ECC (64bit + 8bit)
  • 32 channels of FPGA GTY transceivers up to 32Gbps
  • Two 240pin High-Speed Connectors with 172 user IO
  • Dual ARM Cortex-A7 core processor of 1.2GHz speed
  • 2GB DDR4 for CPU with ECC (32bit+4bit)
  • QorIQ Trust Architecture and Arm TrustZone
  • 4 lanes of 6Gbps SERDES from CPU
  • Industrial Grade Availability
  • 10+ Years long term support
Categories: ,

FPGA

  • Compatible FPGAs with B2104 package:
    • Kintex UltraScale+; KU19P
    • Kintex UltraScale; KU095 and KU115
    • Virtex UltraScale+; VU5P, VU7P, VU9P, VU11P and VU13P
    • Virtex UltraScale; VU080, VU095, VU125, VU160, VU190
  • Up to 1,842K Logic Cells
  • GTY Transceiver x48 up to 32Gbps1
  • 46 LVDS/92 SE FPGA IOs
  • 80 SE FPGA IOs

CPU

  • Dual Arm Cortex-A7 core processor
  • Operation frequency of 1.2GHz
  • QorIQ Trust Architecture and Arm TrustZone
  • High-speed serial interfaces (SERDES) x4 @6Gbps

Memory Interfaces

  • Dual 64-bit DDR4 with ECC from FPGA
  • 128MB QSPI Flash
  • 32bit DDR4 with ECC from CPU
  • 256MB parallel NOR Flash
  • 4MB MRAM
  • 512KB SRAM via SPI

Other On SOM Features

  • 10/100/1000 Ethernet PHY
  • Temperature Sensor
  • TPM2.0 Module via SPI

Board to Board Connector1 Interfaces(240pin):

  • FPGA GTY Transceiver x12 up to 16Gbps
  • 80 SE FPGA Ios
  • 6Gbps SerDes x2 (PCIe/SATA/SGMII)

Board to Board Connector2 Interfaces(240pin):

  • FPGA GTY Transceiver x4 up to 16Gbps
  • 46 LVDS/92 SE FPGA IOs
  • USB 3.0 x1
  • 6Gbps SerDes x1 (PCIe/SATA/SGMII)
  • Gigabit Ethernet x 1
  • USB2.0 x1
  • I2C x 2
  • Debug UART
  • UART x 2
  • JTAG

Board to Board Connector3 Interfaces(240pin):

  • FPGA GTY Transceiver x24 up to 32Gbps2

Board to Board Connector4 Interfaces(80pin):

  • FPGA GTY Transceiver x8 up to 32Gbps

General Features:

Power Input

5V through B2B Connector
Form Factor

110mm x 75mm (OREN+)
BSP Support
  • Linux/Vivado 22.2
  • Yocto Dunfell 3.1

 
Operating Temperature

-40°C to +85°C (Industrial)
Environment Specification

REACH & RoHS3 Compliant

1KU19P Device supports maximum 32 GTY Transceiver Channels only.
2One lane of FPGA GTY transceiver is used for PCIe interface between FPGA and ARM Processor.

DEVELOPMENT KIT

  • 100G Ethernet though QSFP28/QSFP+ Connector
  • 112G FireFly Connector
  • FMC High Pin Count (HPC) Connector
  • FMC+ High Pin Count (HPC) Connector
  • PCIe Gen2 x1 Connector
  • M.2 SATA 3.1 Connector
  • USB 3.0 OTG through TypeC Connector
  • Gigabit Ethernet through RJ45MagJack
  • USB2.0 OTG through MicroAB Connector
  • Dual PMOD Connector
  • Operating Temperature: -20°C to +85°C
  • Form Factor : 140mm x 170mm
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THERMAL SOLUTIONS

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For any highly integrated System on Modules, thermal design is very important factor. iWave Supports heat Spreader and Fan Sink solution for KU19P FPGA based SOM.

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