KU19P FPGA System on Module

KU19P FPGA System on Module


  • Xilinx Kintex Ultrascale+ FPGA with B2104 package
  • Dual 4GB FPGA-DDR4 with ECC (64bit + 8bit)
  • 32 channels of FPGA GTY transceivers up to 32Gbps
  • Two 240pin High-Speed Connectors with 142 user IOs
  • Dual ARM Cortex-A7 core processor of 1.5GHz speed
  • 2GB DDR4 for CPU with ECC (32bit+4bit)
  • QorIQ Trust Architecture and Arm TrustZone
  • 4 lanes of 6Gbps SERDES from CPU
  • Industrial Grade Availability
  • 10+ Years long term support




  • Kintex Ultrascale+ with FFVB2104 package
  • Up to 1684K Logic Cells



  • GTY Transceivers x 32 @32 Gbps*
  • 52 LVDS Pairs and 22 SE FPGA IOs



  • Dual Arm Cortex-A7 core processor
  • Operation frequency of 1GHz


  • QorIQ Trust Architecture and Arm TrustZone
  • High-speed serial interfaces (SERDES) x4 @6Gbps

Memory Interfaces

  • Dual 64-bit DDR4 with ECC from PL
  • 128MB QSPI flash
  • 32bit DDR4 with ECC from CPU


  • 256MB parallel NOR Flash
  • 4MB MRAM
  • 512KB SRAM via SPI

Other On SOM Features

  • 10/100/1000 Ethernet PHY
  • Temperature Sensor
  • TPM2.0 Module via SPI

Board to Board Connector1 Interfaces(240pin):

  • PL GTY Transceiver x8 up to 21Gbps
  • 28 SE IOs from FPGA and CPU


  • USB 3.0 x1
  • 6Gbps SERDES x 1

Board to Board Connector2 Interfaces(240pin):

  • 48 LVDS/96SE FPGA IOs
  • USB 3.0 x1
  • 6Gbps SERDES x 2
  • USB2.0 x1
  • I2C x 2
  • Debug UART
  • UART x 2
  • JTAG

Board to Board Connector3 Interfaces(240pin):

  • PL GTY Transceiver x20 up to 32Gbps*

Board to Board Connector4 Interfaces(80pin):

  • PL GTY Transceiver x4 up to 32Gbps

General Features:

Power Input

5V through B2B Connector

Form Factor

110mm x 75mm (OREN+)

BSP Support


Operating Temperature

-40°C to +85°C (Industrial)

Environment Specification

REACH & RoHS3 Compliant

* One lane of PL GTY transceiver is used for PCIe interface between KU19P and ARM Processor


For any highly integrated System on Modules, thermal design is very important factor. iWave Supports heat Spreader and Fan Sink solution for KU19P FPGA based SOM.


  • 100G Ethernet though QSFP28/QSFP+ Connector
  • 112G FireFly Connector
  • 10G Ethernet through SFP+ Connector
  • 12G SDI Video IN through HD BNC Connector
  • 12G SDI Video OUT through HD BNC Connector
  • 4K HDMI 2.0 IN through HDMI Connector
  • 4K HDMI 2.0 OUT through HDMI Connector
  • Dual FMC High Pin Count (HPC) Connector
  • PCIe Gen2 x1 Connector
  • M.2 SATA 3.1 Connector
  • USB 3.0 OTG through TypeC Connector
  • Gigabit Ethernet through RJ45MagJack
  • USB2.0 OTG through MicroAB Connector
  • Dual PMOD Connector
  • Operating Temperature: -20°C to +85°C
  • Form Factor : 140mm x 170mm

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