	NXP	Renesas	TI , ST
OSM	i.MX 91 i.MX 93 i.MX 8X Lite i.MX 8M Plus	RZ/G2UL RZ/Five RZ/A3UL	TI AM62Ax STM32MP13x - Size S STM32MP13x - Size 0
SMARC	i.MX 91 i.MX 95 i.MX 93 i.MX 8M i.MX 8M Plus i.MX 8 Layerscape LS1021A
Qseven	i.MX 8 i.MX 8M Mini/Nano i.MX 6	RZ/G1H RZ/G1M	TI DM8168
SODIMM	i.MX 93 i.MX 91 i.MX 8M Mini/Nano i.MX 6 i.MX 6 UL/ULL	RZ/G1E
SBC	i.MX 91 i.MX 93 i.MX 8XLite i.MX 8M Plus i.MX 8 i.MX 8M Mini/Nano i.MX6	RZ/G2UL RZ/G1C	TI AM62Ax STM32MP13x - Size S STM32MP13x - Size 0

	AMD	Intel
SoC SoM	RFSoC ZU49/ZU39/ZU29DR Versal AI Edge/Prime Zynq ZU19/ZU17/ZU11 Zynq ZU7/ZU5/ZU4 Zynq ZU5/ZU4/ZU3T/ZU3/ZU2/ZU1 Zynq 7000	Agilex 5 Agilex 7 Stratix 10 Arria 10
FPGA SoM	Virtex UltraScale+ Kintex UltraScale+	Arria 10
PCIe Cards	Zynq RFSoC ADC DAC PCIe Card ZU19/17/11 PCIe SmartNIC Card Kintex-7 PCIe Card PCIe to SD 3.0 M.2 Module
VPX Cards/SBC	Kintex UltraScale+ 3U VPX Zynq ZU19/17/11 3U VPX Zynq ZU5/ZU4/ZU3/ZU2 Kintex-7 3U VPX Card
FMC Cards	PCIe Gen3 x8 FMC Module Quad QSFP28 FMC+ Module PCIe Gen3 x16 FMC+ Module FMC Add-On Cards

Telematics	V2X Solutions	Protocol Stacks
Telematics Connect Hub Telematics Control Unit Rugged Telematics Device Telematics Gateway OBD Dongle	V2X On-Board Unit V2X Road-Side Unit	UDS Protocol Stack J1939 Protocol Stack Automotive Protocol Stacks

ARINC 818 Solutions	ARINC IP Cores	COTS Module
ARINC 818 Recorder ARINC 818 Monitor ARINC 818 Tester ARINC 818 Analyser ARINC 818 to DVI Converter ARINC 818 to HDMI Converter	ARINC 818-3 IP ARINC 818 Switch IP ARINC 818-2 IP ARINC 664 P7 IP	Zynq RFSoC ADC DAC PCIe Card ZU19/17/11 PCIe SmartNIC Card Kintex UltraScale+ 3U VPX Zynq ZU19/17/11 3U VPX Kintex-7 PCIe Card Cyclone V 6U cPCI

ARINC IP Cores	sFPDP IP Cores	Storage IP Cores	Bridge IP Cores	Legacy Processor IP Cores
ARINC 818-3 IP ARINC 818 Switch IP ARINC 818-2 IP ARINC 664 P7 IP	Serial FPDP (sFPDP)	NVMe Host Controller SD / SDIO Host Controller 3.0 NAND Flash Controller SD Memory Slave Controller SDIO Slave Controller SATA Host Controller eMMC Host Controller	VME Slave IP Core (VME to AXI Bridge) PCI Controller PCIe to SD/MMC Bridge SDIO to UART Controller SATA 3.0 Bridge Controller	80188EB Processor 80188XL Processor 80186XL Processor 80186EC Processor 8530 Multi-Protocol Controller 8254 Timer 8259A ICU 8237 DMA

Gateway Solutions	HMI Solutions
Edge AI Gateway Industrial IoT Gateway LoRaWAN Gateway	12.1" Rugged HMI 10.1" Rugged HMI 7" Rugged HMI HMI Panel

Gateway Solutions	HMI Solutions
Edge AI Gateway Industrial IoT Gateway LoRaWAN Gateway	12.1" Rugged HMI 10.1" Rugged HMI 7" Rugged HMI HMI Panel

Content Centre	News	Events
Articles Case Studies Videos	Press Releases Product Updates Newsletters	Webinars Trade shows

Documents

Software

Linux User Manual
Linux - BSP

BUY NOW

TI AM62Ax Based OSM-LF Module

iW-RainboW-G55M^®

AM62Ax with 64-Bit Quad Arm Cortex-A53
Dual core ARM Cortex-R5F Subsystem
2GB LPDDR4 Expandable up to 8GB and 16GB eMMC Flash
C7xV-256 Deep Learning Accelerator (2 TOPS)
Supports Low power mode by Device Manager
IEEE 802.11 a/b/g/n/ac/ax Wi-Fi + BT 5.3 + IEEE 802.15.4
AEC-Q104*
OSM v1.1 Size-LF LGA Solderable Module

Categories: OSM Modules, System On Modules

MOUSER

SPECIFICATION

On Module Feature:

CPU	4 x Arm Cortex-A53@1.4GHz 1 x Arm Cortex-R5F (Integrated as part of MCU Channel with FFI) @800MHz 1 x Arm Cortex-R5F (Integrated to support Device Management) @800MHz
Memory	2GB LPDDR4 expandable up to 8GB 16GB eMMC Flash expandable up to 128GB 16Mb QSPI Flash
Other	IEEE 802.11 a/b/g/n/ac/ax Wi-Fi + BT 5.3 + IEEE 802.15.4

OSM BGA Features:

Main Domain

RGMII x 2 Port
USB2.0 x 2 Port
SD(4-Bit) x 1
MIPI CSI x 1(4 Lane)
RGB-18 bit
CAN x 1 Port
I2C x 2 Port
QSPI x 1 Port (With CS1)
Audio x 1 Port
UART x 2 Port
Debug UART x 1 Port
JTAG x 1 Port
GPIO x 3
PWM x 2
Boot Mode

MCU Domain

MCU_MCAN x 1
MCU_I2C x 1
MCU_SPI x 1 (With 2 chip selects)
MCU_UART x 1
WKUP_UART x 1
MCU_GPIO x 8

OS Support:

Linux 5.10.153 (or higher)
Free RTOS

General Features:

Power Input	5V, 2.5A through OSM BGA
Form Factor	45mm x 45mm
Operating Temperature	-40°C to +85°C (AEC-Grade 3)
Environment Specification	REACH & RoHS3 Compliant

THERMAL SOLUTIONS

For any highly integrated OSM Modules, thermal design is very important factor. iWave Supports Heat Sink and Heat Spreader solution for TI AM62Ax OSM LGA Module.

TI AM62Ax OSM BASED SBC

AM62Ax with 64-Bit Quad ARM Cortex® A53 & Dual core ARM Cortex®-R5F Subsystem
2GB LPDDR4 memory and 16GB eMMC Flash
16Mb QSPI NOR Flash
C7xV-256 Deep Learning Accelerator (up to 2 TOPS)
IEEE 802.11 a/b/g/n/ac/ax Wi-Fi + BT 5.3 + IEEE 802.15.4
Gigabit Ethernet Jack x 1
USB2.0 OTG Micro-B Conn x 1
USB2.0 Header x 1
Debug UART Connector x 1
RTC Battery Connector x 1
Expansion Connector x 3 with support for:
RGMII, UART, SPI, CAN, PWM, I2S, I2C, JTAG & GPIOs
Compact Form Factor of 85mm x 56mm

ENCLOSURE

The Enclosure is essential for a SBC, iWave provides rugged Aluminum and metal enclosure options which keeps the device safe whilst maintaining full access to all the major ports.

Documents

Design Support

Software

Documents

Design Support

Software

TI AM62Ax Based OSM-LF Module

TI AM62Ax Based OSM-LF Module

SPECIFICATION

On Module Feature:

OSM BGA Features:

OS Support:

General Features:

THERMAL SOLUTIONS

TI AM62Ax OSM BASED SBC

ENCLOSURE

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