Virtex UltraScale+ FPGA SOM

Virtex UltraScale+ FPGA SOM


  • Xilinx Virtex UltraScale+ FPGA with B2104 package
  • Dual 4GB FPGA DDR4 with ECC (64bit + 8bit)
  • 2GB DDR4 for FPGA (32bit)
  • 76 FPGA GTY High Speed Transceiver channels upto 32.75Gbps
  • 120 LVDS Pairs or 240 SE FPGA IOs
  • Dual ARM Cortex-A7 core processor of 1.5GHz speed
  • 2GB DDR4 for CPU with ECC (32bit+4bit)
  • QorIQ Trust Architecture and Arm TrustZone
  • 4 lanes of 6Gbps SERDES from CPU
  • Industrial Grade Availability
  • 10+ Years long term support





  • Virtex UltraScale+, FHGB2104 package
  • Up to 3,780K Logic Cells
  • FPGA GTY Transceivers x 76 @ 32.75 Gbps*
  • 120 LVDS Pairs or 240 SE FPGA IOs


  • Dual ARM Cortex-A7 core processor
  • Operation frequency of 1.2GHz
  • QorIQ Trust Architecture and Arm TrustZone
  • High-speed serial interfaces (SERDES) x4 @6Gbps

Memory Interfaces

  • Dual 4GB DDR4-64bit with ECC for FPGA
  • 2GB DDR4-32bit for FPGA
  • 128MB QSPI flash
  • 2GB DDR4-32bit with ECC from CPU
  • 256MB parallel NOR Flash
  • 512KB SRAM via SPI

On SOM Features

  • 10/100/1000 Ethernet PHY
  • Temperature Sensor
  • TPM2.0 Module via SPI


  • RGMII Interface between CPU and FPGA
  • PCIe x1 interface between CPU and FPGA
  • SPI x1 interface between CPU and FPGA

Board to Board Connector1 Interfaces(400pin):

  • 120 LVDS FPGA IOs or 240 Single Ended IOs

Board to Board Connector2 Interfaces(400pin):

  • FPGA GTY Transceiver x28 up to 32.5Gbps
  • Gigabit Ethernet Interface
  • RGMII x1
  • USB 3.0 x1
  • Up to 6Gbps speed SerDes x 3 (PCIe/SATA/SGMII)
  • USB2.0 x1
  • I2C x 2
  • Debug UART
  • MicroSD x1

Board to Board Connector3 Interfaces(240pin):

  • FPGA GTY Transceiver x47 up to 32.75Gbps*

General Features:

Power Input

12V through B2B Connector

Form Factor

120mm x 90mm

BSP Support


Operating Temperature

-40°C to +85°C (Industrial Grade)

Environment Specification

REACH & RoHS3 Compliant

* One lane of FPGA GTY transceiver of Bank231 is used for PCIe interface between VU13P and ARM Processor


For any highly integrated System on Modules, thermal design is very important factor. iWave Supports heat Spreader and Fan Sink solution for VU13P based FPGA SOM.

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