Virtex UltraScale+ FPGA SOM

Virtex UltraScale+ FPGA SOM


  • Xilinx Virtex UltraScale+ FPGA with B2104 package
  • Compatible with VU13P, VU11P, VU9P, VU7P, VU5P, VU160,
    VU190,VU125, VU080, VU095, KU19P, KU095, KU115 FPGA
  • Dual 4GB FPGA-DDR4 with ECC (64bit + 8bit)
  • 48 channels of FPGA GTY transceivers up to 32Gbps
  • Two 240pin High-Speed Connectors with 172 user IO
  • Dual ARM Cortex-A7 core processor of 1.2GHz speed
  • 2GB DDR4 for CPU with ECC (32bit+4bit)
  • QorIQ Trust Architecture and Arm TrustZone
  • 4 lanes of 6Gbps SERDES from CPU
  • Industrial Grade Availability
  • 10+ Years long term support



  • Compatible FPGAs with B2104 package:
    • Virtex UltraScale+; VU5P, VU7P, VU9P, VU11P and VU13P
    • Virtex UltraScale; VU080, VU095, VU125, VU160, VU190
    • Kintex UltraScale+; KU19P
    • Kintex UltraScale; KU095 and KU115
  • Up to 3,780K Logic Cells
  • GTY Transceivers x 48 @32 Gbps*
  • 46 LVDS/92 SE FPGA IOs
  • 80 SE FPGA IOs



  • Dual Arm Cortex-A7 core processor
  • Operation frequency of 1.2GHz
  • QorIQ Trust Architecture and Arm TrustZone
  • High-speed serial interfaces (SERDES) x 4 @6Gbps

Memory Interfaces

  • Dual 64-bit DDR4 with ECC from FPGA
  • 128MB QSPI Flash
  • 32bit DDR4 with ECC from CPU
  • 256MB parallel NOR Flash
  • 4MB MRAM
  • 512KB SRAM via SPI

On SOM Features

  • 10/100/1000 Ethernet PHY
  • Temperature Sensor
  • TPM2.0 Module via SPI

Board to Board Connector1 Interfaces(240pin):

  • FPGA GTY Transceiver x12 up to 16Gbps
  • 80 SE FPGA Ios
  • 6Gbps SerDes x 2 (PCIe/SATA/SGMII)

Board to Board Connector2 Interfaces(240pin):

  • FPGA GTY Transceiver x 4 up to 16Gbps
  • 46 LVDS/92 SE FPGA IOs
  • USB 3.0 x 1
  • 6Gbps SerDes x1 (PCIe/SATA/SGMII)
  • Gigabit Ethernet x 1
  • USB2.0 x 1
  • I2C x 2
  • Debug UART
  • UART x 2
  • JTAG

Board to Board Connector3 Interfaces(240pin):

  • FPGA GTY Transceiver x24 up to 32Gbps*

Board to Board Connector4 Interfaces(80pin):

  • FPGA GTY Transceiver x8 up to 32Gbps

General Features:

Power Input

5V through B2B Connector

Form Factor

110mm x 75mm (OREN+)

BSP Support


Operating Temperature

-40°C to +85°C (Industrial)

Environment Specification

REACH & RoHS3 Compliant

* One lane of FPGA GTY transceiver is used for PCIe interface between FPGA and ARM Processor


For any highly integrated System on Modules, thermal design is very important factor. iWave Supports heat Spreader and Fan Sink solution for VU13P based FPGA SOM.


  • 100G Ethernet though QSFP28/QSFP+ Connector
  • 112G FireFly Connector
  • 10G SFP+ Connector
  • SDI IN/OUT Connector
  • HDMI IN/ OUT Connector
  • FMC High Pin Count (HPC) Connector
  • FMC+ High Pin Count (HPC) Connector
  • Dual PMOD Connector
  • PCIe Gen2 Connector
  • M.2 SATA 3.1 Connector
  • USB 3.0 OTG through TypeC Connector
  • Gigabit Ethernet through RJ45 MagJack
  • USB2.0 OTG through MicroAB Connector
  • Debug UART through USB MicroAB Connector
  • Operating Temperature: -20°C to +85°C
  • Form Factor : 140mm x 170mm

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