Power requirement for electronic devices have risen steadily in recent years, with the rate increase sloping upwards, and that has necessitated enhanced thermal management solutions to preserve performance and maintain the mean time between failures of these devices.
Therefore, the temperature of the devices must be calculated not to exceed the maximum value. To design a good thermal management solution, the junction temperature should always be kept at the lowest operating temperature. There are several techniques for cooling including various styles of heatspreaders, heatsinks, heatpipes, forced air systems, fans and liquid cooling system.
Our engineers have been working on thermal solutions for many years, we have the capability and tools to provide thermal analysis of components and systems.
Thermal Solutions Design Based on Thermal Analysis
Heatspreader is a most important component which dissipate the heat dissipation from the chip into the environment. Thermal resistance is the major one that disturb the conductivity. Our team undergo several studies to carry out the spreading resistance.
Heatsink is a component used to prevent electrical components from overheating. Therefore the device will be able to work at the specified temperature. The effective heat dissipation is largely dependent on its design. As a passive heat exchanger, a heat sink design should allow easy heat transfer to its environment. iWave design team has good understanding with the thermal calculations to avoid the thermal resistance.
iWave have experience in active cooling solution that rely on an external device to enhance heat transfer. With the help of simulation tool our designers can predict the airflow,temperature distribution and heat transfer rate of systems which helps to design a perfect cooling solution.
VPX & VME Thermal Solutions
iWave provide thermal solution for openVPX computing. Our skilled mechanical designers evaluate the behaviour of the design under adverse temperatures and thermal load conditions, checking for hotspots and seeking areas for improvement.
Material & Attachment Method
Effectiveness of thermal management will improve by choosing an appropriate attachment method. Attachment method is finalized by the device thermal and mechanical requirement. Common attachment methods are Thermal Tapes, Push Pins, Screws, Plastic Clips and Spring Loaded Screws.
THERMAL SOLUTION PRODUCTS
SMARC Thermal Solution
Qseven Thermal Solution
COM-Express Thermal Solution
3U VPX Thermal Solution
Generic Heatspreader and Heatsink
Intel Stratix 10 SoC FPGA Fansink
i.MX 8M Plus Pico ITX SBC Heatsink
3U VPX Heatspreader
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