Renesas RZ/G2UL or RZ/A3UL or RZ/Five based OSM-MF LGA Module

Renesas RZ/G2UL or RZ/A3UL or RZ/Five based OSM-MF LGA Module


The data provided is Preliminary and Subject to Change

  • Renesas RZ/G2UL or RZ/A3UL SoC with 64-bit ARMv8.2 A Architecture
  • Renesas RZ/Five SoC with AndeStar™ V5 Instruction Set Architecture
  • 1GB DDR4 Memory (Expandable based on chip availability)
  • Supports Cortex-A55 cores (RZ/G2UL & RZ A3UL)
  • Supports Cortex-M33 core for RTOS (RZ/G2UL)
  • Supports 2× RGMII
  • 10+ years of Product Longevity Program
  • OSM v1.1 Size-MF LGA Module



On Module Feature:


RZ/G2UL : 1 x Arm® Cortex®-A55 (1.0GHz)
1 x Arm® Cortex®-M33 (200MHz)
RZ/A3UL : 1 x Arm® Cortex®-A55 (1.0GHz)
RZ/Five : 1 x RISC-V (AX45MP Single) (1.0GHz)

Memory & Storage

DDR4 – 1GB
eMMC Flash – 16GB (Expandable)

OSM BGA Features:

  • RGMII x 2
  • USB2.0 x 2
  • SDIO x 1
  • QSPI x 1
  • SPI x 1
  • CAN x 1
  • I2C x 2


  • MIPI CSI x 1 (Not available in Five SoC)
  • RGB x 1 (Not available in Five SoC)
  • I2S x 1
  • UART x 3
  • PWM x 1
  • GPIOs

OS Support:


General Features:

Power Input

5V, 2.5A through OSM BGA

Form Factor

30mm x 45mm

Operating Temperature

-40°C to +85°C

Environment Specification

REACH & RoHS3 Compliant


For any highly integrated OSM Modules, thermal design is very important factor. iWave Supports Heat Sink and Heat Spreader solution for Renesas RZ/G2UL or RZ/A3UL or RZ/Five based OSM LGA Module.

OSM Based Pico ITX SBC

  • OSM based Pico ITX SBC
  • 2 x 1000/100/10 Mbps Ethernet
  • USB 2.0 OTG (micro AB Receptacle Connector) x 1
  • Debug UART Header x 1
  • Audio In & Out Jack through I2S Codec x 1
  • RS232 Header x 1 (without CTS/RTS)
  • RGB Display
  • MIPI CSI through MIPI CSI Connector (Not available in Five CPU)


The Enclosure is essential for a SBC, iWave provides rugged Aluminum and metal enclosure options which keeps the device safe whilst maintaining full access to all the major ports.

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