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Design Support

Software

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i.MX 93 OSM-LF LGA Module

i.MX 93 OSM-LF LGA Module

iW-RainboW-G50M®

  • i.MX 93 CPU with 64-bit ARM v8.2-A Architecture
  • NPU with up to 0.5 TOP/s Neural Network performance
  • Wi-Fi 6, Bluetooth 5.3 & IEEE802.15.4 connectivity
  • Supports Cortex-A55 cores
  • Supports 2 × 1Gbps Ethernet (1 with TSN)
  • 10+ years of Product Longevity Program
  • OSM v1.1 Size-L LGA  Solderable Module
Categories: , ,

On Module Feature:

CPU

i.MX 9352: 2 x Cortex-A55, NPU
i.MX 9351: 1 x Cortex-A55, NPU
i.MX 9332: 2 x Cortex-A55
i.MX 9331: 1 x Cortex-A55
Memory & Storage

2GB LPDDR4/4X(By default, LPDDR4X is supported)
16GB eMMC Flash expandable up to 256GB
Other

Wi-Fi 6, Bluetooth 5.3 & IEEE802.15.4
1:4 USB2.0 HUB
External RTC Controller
Programming Header

OSM LGA Features:

  • RGMII x 2
  • SD(4bit) x 1
  • USB 2.0 OTG x 1
  • USB 2.0 HOST x 2
  • LVDS x 1
  • 1 x 2 lane MIPI_CSI
  • 1 x 4 lane MIPI_DSI
  • CAN x 2
  • UART x 3 (1 is optional)
  • Debug UART x 1
  • I2S x 1
  • SPI x 1
  • I2C x 2
  • PWM x 1
  • JTAG x 1
  • GPIOs

OS Support:

  • Linux 6.1.22
  • QNX 7.1

General Features:

Power Input

5V, 2.5A through OSM BGA
Form Factor

45mm x 45mm (Size L)
Operating Temperature

-40°C to +85°C (Industrial)
Environment Specification

REACH & RoHS3 Compliant

OSM Based Pico ITX SBC

i.MX-93-SBC_TopView-1024x763-min
i.MX-93-SBC_BottomView-e1670497495970-1024x769-min
i.MX-93SBC_SideView-1024x780-min
  • Dual 1000/100/10 Mbps Ethernet
  • CAN Header x 1
  • USB 2.0 OTG (micro AB Receptacle Connector) x 1
  • Dual USB 2.0 Host (TypeA) x 1
  • Micro SD
  • 4 Lane MIPI DSI Display Connector
  • 2 Lane MIPI DSI Display Connector (Optional)
  • 4 Lane LVDS Display Connector
  • MIPI CSI Camera Connector
  • Debug UART Header x 1
  • 3.5mm Audio In & Out Jack through I2S Codec x 1
  • GNSS receiver Module –GPS/GLONASS/Galileo/BeiDo (Optional)
  • M.2 Connector Key B/M (Key M is optional)
  • USB Touch Header x 1
  • LINE IN & OUT Speaker Headers
  • RS232 Header x 1
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BROCHURE

THERMAL SOLUTIONS

Top view of heat sink for i.MX 8M plus
Bottom view of heat sink for i.MX 8M plus
Top view of heat sink spreader for i.MX 8M plus
Bottom view of heat sink spreader for i.MX 8M plus

For any highly integrated OSM Modules, thermal design is very important factor. iWave Supports Heat Sink and Heat Spreader solution for i.MX93 OSM LGA Module.

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Top view of heat sink for i.MX 8M plus
Bottom view of heat sink for i.MX 8M plus
Top view of heat sink spreader for i.MX 8M plus
Bottom view of heat sink spreader for i.MX 8M plus

For any highly integrated OSM Modules, thermal design is very important factor. iWave Supports Heat Sink and Heat Spreader solution for i.MX93 OSM LGA Module.

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ENCLOSURE

Enclosure for i.MX 8M Plus Pico ITX SBC

The Enclosure is essential for an SBC, iWave provides rugged Aluminum and metal enclosure options which keeps the device safe whilst maintaining full access to all the major ports.

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