	NXP	Renesas	TI , ST
OSM	i.MX 91 i.MX 93 i.MX 8X Lite i.MX 8M Plus	RZ/G2UL RZ/Five RZ/A3UL	TI AM62Ax STM32MP13x - Size S STM32MP13x - Size 0
SMARC	i.MX 91 i.MX 95 i.MX 93 i.MX 8M i.MX 8M Plus i.MX 8 Layerscape LS1021A
Qseven	i.MX 8 i.MX 8M Mini/Nano i.MX 6	RZ/G1H RZ/G1M	TI DM8168
SODIMM	i.MX 93 i.MX 91 i.MX 8M Mini/Nano i.MX 6 i.MX 6 UL/ULL	RZ/G1E
SBC	i.MX 91 i.MX 93 i.MX 8XLite i.MX 8M Plus i.MX 8 i.MX 8M Mini/Nano i.MX6	RZ/G2UL RZ/G1C	TI AM62Ax STM32MP13x - Size S STM32MP13x - Size 0

	AMD	Intel
SoC SoM	RFSoC ZU49/ZU39/ZU29DR Versal AI Edge/Prime Zynq ZU19/ZU17/ZU11 Zynq ZU7/ZU5/ZU4 Zynq ZU5/ZU4/ZU3T/ZU3/ZU2/ZU1 Zynq 7000	Agilex 5 Agilex 7 Stratix 10 Arria 10
FPGA SoM	Virtex UltraScale+ Kintex UltraScale+	Arria 10
PCIe Cards	Zynq RFSoC ADC DAC PCIe Card ZU19/17/11 PCIe SmartNIC Card Kintex-7 PCIe Card PCIe to SD 3.0 M.2 Module
VPX Cards/SBC	Kintex UltraScale+ 3U VPX Zynq ZU19/17/11 3U VPX Zynq ZU5/ZU4/ZU3/ZU2 Kintex-7 3U VPX Card
FMC Cards	PCIe Gen3 x8 FMC Module Quad QSFP28 FMC+ Module PCIe Gen3 x16 FMC+ Module FMC Add-On Cards

Telematics	V2X Solutions	Protocol Stacks
Telematics Connect Hub Telematics Control Unit Rugged Telematics Device Telematics Gateway OBD Dongle	V2X On-Board Unit V2X Road-Side Unit	UDS Protocol Stack J1939 Protocol Stack Automotive Protocol Stacks

ARINC 818 Solutions	ARINC IP Cores	COTS Module
ARINC 818 Recorder ARINC 818 Monitor ARINC 818 Tester ARINC 818 Analyser ARINC 818 to DVI Converter ARINC 818 to HDMI Converter	ARINC 818-3 IP ARINC 818 Switch IP ARINC 818-2 IP ARINC 664 P7 IP	Zynq RFSoC ADC DAC PCIe Card ZU19/17/11 PCIe SmartNIC Card Kintex UltraScale+ 3U VPX Zynq ZU19/17/11 3U VPX Kintex-7 PCIe Card Cyclone V 6U cPCI

ARINC IP Cores	sFPDP IP Cores	Storage IP Cores	Bridge IP Cores	Legacy Processor IP Cores
ARINC 818-3 IP ARINC 818 Switch IP ARINC 818-2 IP ARINC 664 P7 IP	Serial FPDP (sFPDP)	NVMe Host Controller SD / SDIO Host Controller 3.0 NAND Flash Controller SD Memory Slave Controller SDIO Slave Controller SATA Host Controller eMMC Host Controller	VME Slave IP Core (VME to AXI Bridge) PCI Controller PCIe to SD/MMC Bridge SDIO to UART Controller SATA 3.0 Bridge Controller	80188EB Processor 80188XL Processor 80186XL Processor 80186EC Processor 8530 Multi-Protocol Controller 8254 Timer 8259A ICU 8237 DMA

Gateway Solutions	HMI Solutions
Edge AI Gateway Industrial IoT Gateway LoRaWAN Gateway	12.1" Rugged HMI 10.1" Rugged HMI 7" Rugged HMI HMI Panel

Gateway Solutions	HMI Solutions
Edge AI Gateway Industrial IoT Gateway LoRaWAN Gateway	12.1" Rugged HMI 10.1" Rugged HMI 7" Rugged HMI HMI Panel

Content Centre	News	Events
Articles Case Studies Videos	Press Releases Product Updates Newsletters	Webinars Trade shows

BUY NOW

i.MX 93 OSM-LF LGA Module

iW-RainboW-G50M^®

i.MX 93 CPU with 64-bit ARM v8.2-A Architecture
NPU with up to 0.5 TOP/s Neural Network performance
Wi-Fi 6, Bluetooth 5.3 & IEEE802.15.4 connectivity
Supports Cortex-A55 cores
Supports 2 × 1Gbps Ethernet (1 with TSN)
10+ years of Product Longevity Program
OSM v1.1 Size-L LGA Solderable Module

Categories: System On Modules, SODIMM Modules, Uncategorized

SPECIFICATION

On Module Feature:

CPU	i.MX 9352: 2 x Cortex-A55, NPU i.MX 9351: 1 x Cortex-A55, NPU i.MX 9332: 2 x Cortex-A55 i.MX 9331: 1 x Cortex-A55
Memory & Storage	2GB LPDDR4/4X(By default, LPDDR4X is supported) 16GB eMMC Flash expandable up to 128GB
Other	Wi-Fi 6, Bluetooth 5.3 & IEEE802.15.4 1:4 USB2.0 HUB External RTC Controller Programming Header

OSM LGA Features:

RGMII x 2
SD(4bit) x 1
USB 2.0 OTG x 1
USB 2.0 HOST x 4
LVDS x 1
1 x 2 lane MIPI_CSI
1 x 4 lane MIPI_DSI
CAN x 2
UART x 3 (1 is optional)
Debug UART x 1
I2S x 1
SPI x 1
I2C x 2
PWM x 1
JTAG x 1
GPIOs

OS Support:

Linux 6.1.22
QNX 7.1

General Features:

Power Input	5V, 2.5A through OSM BGA
Form Factor	45mm x 45mm (Size L)
Operating Temperature	-40°C to +85°C (Industrial)
Environment Specification	REACH & RoHS3 Compliant

THERMAL SOLUTIONS

For any highly integrated OSM Modules, thermal design is very important factor. iWave Supports Heat Sink and Heat Spreader solution for i.MX93 OSM LGA Module.

OSM Based Pico ITX SBC

Dual 1000/100/10 Mbps Ethernet
CAN Header x 1
USB 2.0 OTG (micro AB Receptacle Connector) x 1
Dual USB 2.0 Host (TypeA) x 1
Micro SD
4 Lane MIPI DSI Display Connector
2 Lane MIPI DSI Display Connector (Optional)
4 Lane LVDS Display Connector
MIPI CSI Camera Connector
Debug UART Header x 1
3.5mm Audio In & Out Jack through I2S Codec x 1
GNSS receiver Module –GPS/GLONASS/Galileo/BeiDo
M.2 Connector Key B/M (Key M is optional)
USB Touch Header x1
LINE IN & OUT Speaker Headers
RS232 Header x 1

ENCLOSURE

The Enclosure is essential for an SBC, iWave provides rugged Aluminum and metal enclosure options which keeps the device safe whilst maintaining full access to all the major ports.

Documents

Design Support

Software

Documents

Design Support

Software

i.MX 93 OSM-LF LGA Module

i.MX 93 OSM-LF LGA Module

SPECIFICATION

On Module Feature:

OSM LGA Features:

OS Support:

General Features:

THERMAL SOLUTIONS

OSM Based Pico ITX SBC

ENCLOSURE

RELATED VIDEOS

Related products

i.MX 8XLite OSM – SE LGA Module

i.MX 8M Plus OSM-LF LGA Module

i.MX 91 Pico ITX SBC

i.MX 91 OSM-LF LGA Module

i.MX 93 Pico ITX SBC

i.MX 8M Plus Pico ITX SBC

i.MX 8XLite Pico ITX SBC

Related News

i.MX 93 System on Module Paving the way for Advanced EV Charging Systems

iWave launches iW-RainboW-G50M: The NXP Semiconductors i.MX 93 SoC-Based SOM powering energy efficient edge computing

OSM Solderable System on Module and its Advantages

8 Reasons Why You Should Choose a System on Module in Your Next Product Design

The OSM Standard for System on Modules – Explained

Webinar – Bring your AI applications to new heights with iWave’s i.MX 93 OSM Solderable System on Modules