ZU19/ZU17/ZU11- Zynq UltraScale+ SOM

ZU19/ZU17/ZU11- Zynq UltraScale+ SOM

iW-RainboW-G35M

Highlights

  • Xilinx’s Zynq Ultrascale+ MPSoC with FFVC1760 package
  • Maximum Memory Bandwidth:
    • 64bit, 8GB PS DDR4 RAM with ECC
    • 128bit, 16GB PL DDR4 RAM
  • Two 240pin High Speed High Density Connectors:
    • 16 GTY Transceivers (32.75Gbps) & 16 GTH Transceivers (16.3Gbps)
  • Two 240pin High Speed Connectors:
    • 16 GTH Transceivers (16.3Gbps), 4 GTR Transceivers (6Gbps) & 142 user IOs
  • Optional On-SOM MAX10 FPGA
  • Industrial grade availability
  • 10+ Years Longevity

Downloads

Specification

On Module Features:

  • ZU19/ZU17/ZU11 – Zynq Ultrascale+ MPSoC
    • Processing System (PS)
      • Quad/Dual ARM Cortex-A53 @ 1.5GHz, Dual Cortex-R5 @ 600MHz
      • H.264/H.265 Video Encoder/Decoder (VCU)
      • ARM Mali-400MP2 GPU @ 677MHz
    • Programming Logic (PL)
      • Up to 1143K Logic cells & 522K LUTs
      • PL GTH High Speed Transceivers x 16 @ 16.3 Gbps
  • 64bit, 4GB DDR4 RAM with ECC for PS (Upgradable upto 8GB)
  • Dual 64bit, 4GB DDR4 RAM for PL (Upgradable upto 16GB)
  • 8GB eMMC Flash (Upgradable)
  • RGMII Ethernet PHY Transceiver
  • USB2.0 ULPI Transceiver

 

 

Two 240pin High Speed High Density Board to Board Connectors Interfaces:

  • PL-GTY High Speed Transceivers (upto 32.75Gbps) x 16
  • PL-GTH High Speed Transceivers (upto 16.3Gbps) x 16

Two 240pin High Speed Board to Board Connectors Interfaces:

From PS Block

  • PS-GTR High Speed Transceivers (upto 6Gbps) x 2
  • Gigabit Ethernet x 1 Port (through On-SOM Gigabit Ethernet PHY)
  • USB2.0 OTG x 1 Port (through On-SOM USB2.0 transceiver)
  • RGMII Interface or ULPI Interface x 1
  • SD (4bit) x 1
  • SPI x 1
  • CAN x 2
  • Debug UART x 1
  • Data UART x 1
  • I2C x 2
  • PS JTAG

From PL Block

  • PL-GTH High Speed Transceivers (upto 16.3Gbps) x 16
  • PL IOs – 142 IOs
    • HP Bank IOs – Upto 48 LVDS IOs/96 Single ended (SE)
    • HD Bank IOs – Upto 23 LVDS IOs/46 Single ended (SE)
    • GC Global Clock Input pins – Upto 15 LVDS/SE
    • ADC Input pins – Upto 16 Differential/Single Ended

 

 

 

General Features:

Power Input

5V through B2B Connector

Operating Temperature

-40°C to +85°C

Form Factor

75mm x 110mm

Environment Specification

RoHS & REACH Compliant

Compliance

CE*

* Under Progress

THERMAL SOLUTIONS

For any highly integrated System On Modules, thermal design is very important factor. iWave Supports Heat Sink and Fan Sink Solution for ZU19/17/11EG Zynq UltraScale+ MPSoC SOM.

DEVELOPMENT KIT

Specifications:

  • 100G Ethernet though QSFP28/QSFP+ Connector
  • 112G FireFly Connector
  • 10G Ethernet through SFP+ Connector
  • 12G SDI Video IN through HD BNC Connector
  • 12G SDI Video OUT through HD BNC Connector
  • 4K HDMI 2.0 IN through HDMI Connector
  • 4K HDMI 2.0 OUT through HDMI Connector
  • Dual FMC High Pin Count (HPC) Connector
  • DP 1.2a Display Port Connector
  • PCIe Gen2 x4 Connector
  • M.2 SATA 3.1 Connector
  • USB 3.0 OTG through TypeC Connector
  • Dual Gigabit Ethernet through RJ45MagJack
  • USB2.0 OTG through MicroAB Connector
  • Standard SD Connector
  • CAN Header
  • 20 Pin Header (for PS IOs)
  • Dual PMOD Connector
  • Operating Temperature: -20°C to +85°C
  • Form Factor : 140mm x 170mm

FMC Module

iWave supports FMC Module for Zynq MPSoC Development Kit with PCIe Gen3 x8 Rootport & Endpoint Connector, M.2 PCIe (2lane) NVMe Connector, MIPI CSI Connector and MIPI DSI Connector.

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