ZU7/ZU5/ZU4- Zynq UltraScale+ SOM

ZU7/ZU5/ZU4- Zynq UltraScale+ SOM

iW-RainboW-G30M®

  • Xilinx’s Zynq Ultrascale+ MPSoC family with FBVB900 package
  • Compatible with Zynq UltraScale+ ZU7/ZU5/ZU4 CG/EG/EV devices
  • 64bit upto 8GB PS DDR4 with ECC & 16bit upto 4GB PL DDR4
  • Up to 504K Logic cells & 230K LUTs
  • Two 240pin High Speed Connectors with 142 user IOs
  • 16 Channels GTH Transceivers upto 16.3Gbps
  • 4 Channels GTR Transceivers upto 6Gbps
  • Industrial grade availability
  • 10+ Years Longevity
Category:

On Module Features:

  • ZU7/ZU5/ZU4 – Zynq Ultrascale+ MPSoC
    • Processing System (PS)
      • Quad/Dual Arm Cortex-A53 @1.5GHz, Dual Cortex-R5 @600MHz
      • H.264/H.265 Video Encoder/Decoder (VCU)
      • Arm Mali-400MP2 GPU @677MHz
    • Programming Logic (PL)
      • Up to 504K Logic cells & 230K LUTs
      • PL GTH High Speed Transceivers x 16 @16.3 Gbps
  • 64bit, 4GB DDR4 RAM with ECC for PS (Upgradable upto 8GB)
  • 16bit, 2GB DDR4 RAM for PL (Upgradable upto 4GB)
  • 8GB eMMC Flash (Upgradable)
  • RGMII Ethernet PHY Transceiver
  • USB2.0 ULPI Transceiver

 

 

Board to Board Connectors Interfaces:

From PS Block

  • PS-GTR High Speed Transceivers (upto 6Gbps) x 2
  • Gigabit Ethernet x 1 (through On-SOM Gigabit Ethernet PHY)
  • USB2.0 OTG x 1 (through On-SOM USB2.0 transceiver)
  • RGMII Interface or ULPI Interface x 1
  • SD (4bit) x 1
  • SPI x 1
  • CAN x 2
  • Debug UART x 1
  • Data UART x 1
  • I2C x 2
  • PS JTAG

From PL Block

  • PL-GTH High Speed Transceivers (upto 16.3Gbps) x 16
  • PL IOs – 142 IOs
    • HP Bank IOs – Up to 48 LVDS IOs/96 Single ended (SE)
    • HD Bank IOs – Up to 23 LVDS IOs/46 Single ended (SE)
    • GC Global Clock Input pins – Up to 15 LVDS/SE
    • ADC Input pins – Up to 16 Differential/Single Ended

 

 

OS Support

  • Linux BSP – Petalinux 2022.2
  • Baremetal BSP – Vivado 2020.1

General Features:

Power Input

5V through B2B Connector

Operating Temperature

-40°C to +85°C (Industrial)

Form Factor

75mm x 95mm (OREN)

Environment Specification

RoHS & REACH Compliant

Compliance

CE*

* Under Progress

DEVELOPMENT KIT

  • 10G Ethernet through SFP+ Connector
  • 3G/12G SDI Video IN through HD BNC Connector
  • 3G/12G SDI Video OUT through HD BNC Connector
  • Dual FMC High Pin Count (HPC) Connector
  • DP1.2a Display Port Connector
  • PCIe Gen2 x4 Connector
  • M.2 SATA 3.1 Connector
  • USB 3.0 OTG through TypeC Connector
  • Dual Gigabit Ethernet through RJ45MagJack
  • USB2.0 OTG through MicroAB Connector
  • Standard SD Connector
  • CAN Header
  • Dual PMOD Connector
  • RTC Coin Cell Holder
  • Operating Temperature: -20°C to +85°C
  • Form Factor : 130mm x 140mm

Need help with your FPGA and Product Design?

THERMAL SOLUTIONS

For any highly integrated System On Modules, thermal design is very important factor. iWave Supports Heat Sink and Fan Sink Solution for ZU7/5/4 Zynq UltraScale+ MPSoC SOM.

PCIe Gen3 x8 FMC MODULE

iWave supports FMC Module for Zynq MPSoC Development Kit with PCIe Gen3 x8 Rootport/Endpoint Slot, M.2 PCIe (2lane) NVMe Connector, MIPI CSI Connector and MIPI DSI Connector..

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