ZU7/ZU5/ZU4- Zynq UltraScale+ SOM

ZU7/ZU5/ZU4- Zynq UltraScale+ SOM

iW-RainboW-G30M

Highlights

  • Xilinx’s Zynq Ultrascale+ MPSoC with FBVB900 package
  • 64bit, 8GB PS DDR4 with ECC & 16bit, 4GB PL DDR4
  • Two 240pin High Speed Connectors with 142 user IOs
  • 16 Channels GTH Transceivers upto 16.3Gbps
  • 4 Channels GTR Transceivers upto 6Gbps
  • Industrial grade availability
  • 10+ Years Longevity
Category:

Downloads

Specification

On Module Features:

  • ZU7/ZU5/ZU4 – Zynq Ultrascale+ MPSoC
    • Processing System (PS)
      • Quad/Dual ARM Cortex-A53 @ 1.5GHz, Dual Cortex-R5 @ 600MHz
      • H.264/H.265 Video Encoder/Decoder (VCU)
      • ARM Mali-400MP2 GPU @ 677MHz
    • Programming Logic (PL)
      • Up to 504K Logic cells & 230K LUTs
      • PL GTH High Speed Transceivers x 16 @ 16.3 Gbps
  • 64bit, 4GB DDR4 RAM with ECC for PS (Upgradable upto 8GB)
  • 16bit, 2GB DDR4 RAM for PL (Upgradable upto 4GB)
  • 8GB eMMC Flash (Upgradable)
  • RGMII Ethernet PHY Transceiver
  • USB2.0 ULPI Transceiver

 

 

Board to Board Connectors Interfaces:

From PS Block

  • PS-GTR High Speed Transceivers (upto 6Gbps) x 2
  • Gigabit Ethernet x 1 (through On-SOM Gigabit Ethernet PHY)
  • USB2.0 OTG x 1 (through On-SOM USB2.0 transceiver)
  • RGMII Interface or ULPI Interface x 1
  • SD (4bit) x 1
  • SPI x 1
  • CAN x 2
  • Debug UART x 1
  • Data UART x 1
  • I2C x 2
  • PS JTAG

From PL Block

  • PL-GTH High Speed Transceivers (upto 16.3Gbps) x 16
  • PL IOs – 142 IOs
    • HP Bank IOs – Upto 48 LVDS IOs/96 Single ended (SE)
    • HD Bank IOs – Upto 23 LVDS IOs/46 Single ended (SE)
    • GC Global Clock Input pins – Upto 15 LVDS/SE
    • ADC Input pins – Upto 16 Differential/Single Ended

 

 

General Features:

Power Input

5V through B2B Connector

Operating Temperature

-40°C to +85°C

Form Factor

75mm x 95mm

Environment Specification

RoHS & REACH Compliant

Compliance

CE*

* Under Progress

THERMAL SOLUTIONS

For any highly integrated System On Modules, thermal design is very important factor. iWave Supports Heat Sink and Fan Sink Solution for ZU7/5/4 Zynq UltraScale+ MPSoC SOM.

DEVELOPMENT KIT

  • 10G Ethernet through SFP+ Connector
  • 3G/12G SDI Video IN through HD BNC Connector
  • 3G/12G SDI Video OUT through HD BNC Connector
  • Dual FMC High Pin Count (HPC) Connector
  • DP1.2a Display Port Connector
  • PCIe Gen2 x4 Connector
  • M.2 SATA 3.1 Connector
  • USB 3.0 OTG through TypeC Connector
  • Dual Gigabit Ethernet through RJ45MagJack
  • USB2.0 OTG through MicroAB Connector
  • Standard SD Connector
  • CAN Header
  • Dual PMOD Connector
  • RTC Coin Cell Holder
  • Operating Temperature: -20°C to +85°C
  • Form Factor : 130mm x 140mm

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