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Design Support

Software

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i.MX 93 SODIMM SOM

i.MX 93 SODIMM SOM

iW-RainboW-G50M®

  • i.MX 93 CPU with 64-bit ARM v8.2-A Architecture
  • NPU with up to 0.5 TOP/s Neural Network performance
  • IEEE 802.11b/g/n/ac/ax Wi-Fi & Bluetooth 5.3
  • Supports Cortex-A55 cores
  • Supports 1 × 1Gbps Ethernet
  • 10+ years of Product Longevity Program
  • Power and Cost Optimised
  • Modular & Compact SODIMM form factor 67.6mm X 37mm
Categories: ,

On Module Feature:

CPU
  • i.MX 9352: 2x Cortex®-A55, NPU, MIPI DSI, LVDS, MIPI CSI, Parallel camera, Parallel display, 2x Ethernet, 2x USB 2.0, 7x I2S TDM
  • i.MX 9351: 1 x Cortex®-A55, NPU, MIPI DSI, LVDS, MIPI CSI, Parallel camera, Parallel display, 2x Ethernet, 2x USB 2.0, 7x I2S TDM
  • i.MX 9332: 2x Cortex®-A55, MIPI DSI, LVDS, MIPI CSI, Parallel camera, Parallel display, 2x Ethernet, 2x USB 2.0, 7x I2S TDM
  • i.MX 9331: 1x Cortex®-A55, MIPI DSI, LVDS, MIPI CSI, Parallel camera, Parallel display, 2x Ethernet, 2x USB 2.0, 7x I2S TDM
Memory & Storage
  • LPDDR4X – 2GB
  • eMMC Flash – 16GB (Expandable)

Other On-SOM Features

  • IEEE 802.11a/b/g/n/ac/ax+ Bluetooth 5.3+ IEEE802.15.4 (Optional)
  • Gigabit Ethernet PHY Transceiver x 1
  • EEPROM
  • RTC Controller
  • TPM module (Optional)

SODIMM PCB Edge Interfaces

  • Gigabit Ethernet x 1 Port
  • LVDS x 1
  • MIPI DSI (4 Lane) x 1 Channel
  • MIPI CSI (2 Lane) x 1 Channel
  • SD (4bit) x 1 Port
  • USB 2.0 OTG x 1 Port
  • USB 2.0 Host x 1
  • SAI (Audio Interface) x 1 Port
  • Debug UART
  • Data UART (without CTS & RTS) x 1 Port
  • PWM x 2 Ports
  • CAN x 2
  • JTAG
  • GPIOs
  • I2C
  • SPI
  • RGB 24 bit (Optional)
  • QOS RGMII signals (Optional)
  • Tamper x 2(Optional)
  • CLKIN x 2(Optional)
  • ADC x 4(Optional)

OS Support:

  • Linux 6.1.22

General Features:

Power Input

3.3V, 2A Input from SODIMM Edge Connector
Form Factor

67.6mm x 37mm
Operating Temperature

-40°C to +85°C (Industrial Grade)

DEVELOPMENT KIT

  • Debug UART through USB Micro AB Connector
  • DATA UART x 1 Port through Header
  • 10/100/1000 Mbps Ethernet through RJ45-MagJack-1
  • USB 2.0 OTG as a device x 1 Port through Micro AB Connector
  • USB 2.0 Host x 2 Ports through USB Type-A Connector
  • SD x 1 Port through Micro SD Connector
  • CAN Module
  • I2S Audio Codec with 3.5mm Audio IN/OUT jack
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THERMAL SOLUTIONS

Heatsink_Front
Heatspreader_Front

For any highly integrated System On Modules, thermal design is very important factor. iWave Supports Heat Sink and Heat Spreader Solution for i.MX 93 SODIMM SOM.

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