i.MX 93 SMARC SOM

i.MX 93 SMARC SOM

iW-RainboW-G50M®

  • i.MX 93 CPU with 64-bit ARM v8.2-A Architecture
  • NPU with up to 0.5 TOP/s Neural Network performance
  • IEEE 802.11b/g/n/ac/ax Wi-Fi & Bluetooth 5.3
  • Supports Cortex-A55 cores
  • SMARC v2.1.1 compatible SOM
  • 10+ years of Product Longevity Program

SPECIFICATION

On Module Feature:

CPU
  • i.MX 93 Processor
    • i.MX 9352: 2x Cortex®-A55, NPU, MIPI DSI, LVDS, MIPI CSI, Parallel camera, Parallel display, 2x Ethernet, 2x USB 2.0, 7x I2S TDM
    • i.MX 9351: 1 x Cortex®-A55, NPU, MIPI DSI, LVDS, MIPI CSI, Parallel camera, Parallel display, 2x Ethernet, 2x USB 2.0, 7x I2S TDM
    • i.MX 9332: 2x Cortex®-A55, MIPI DSI, LVDS, MIPI CSI, Parallel camera, Parallel display, 2x Ethernet, 2x USB 2.0, 7x I2S TDM
    • i.MX 9331: 1x Cortex®-A55, MIPI DSI, LVDS, MIPI CSI, Parallel camera, Parallel display, 2x Ethernet, 2x USB 2.0, 7x I2S TDM
  • i.MX 91 Processor
    • i.MX 91: 1x Cortex®-A55, Parallel camera, Parallel display, 2x Ethernet, 2x USB 2.0
Memory & Storage
  • LPDDR4/4X – 2GB (i.MX 93 support LPDDR4X & i.MX 91 supports LPDDR4)
  • eMMC Flash – 16GB (Expandable)
  • EEPROM
  • Micro SD Slot (Optional)
Other
  • IEEE 802.11a/b/g/n/ac/ax+ Bluetooth 5.3+ IEEE802.15.4 (Optional)
  • RTC Controller
  • USB2.0 1:4 Hub
  • Gigabit Ethernet PHY Transceiver x 2
  • TPM2.0 (Optional)
  • UART Header (Optional)
  • JTAG Header (Optional)

Edge Connector Features:

  • Gigabit Ethernet x 2
  • USB 2.0 OTG x 1
  • USB 2.0 Host x 4
  • SD (4bit) x 1
  • SAI/I2S (Audio Interface) x 1
  • SPI x 2 (1 is optional)
  • Data UART with flow control x 2
  • Data UART w/o flow control x 1
  • Debug UART x 1
  • MIPI_DSI(4lane) x 1*
  • MIPI_CSI(2lane) x 1*
  • LVDS x 1*
  • I2C x 2
  • GPIOs x 19
  • PWM x 1
  • Tamper x 2 (optional through RSVD pins)

OS Support

  • Linux 6.1.22

General Features:

Power Input

5V, 2.5A through SMARC Edge Connector

Form Factor

82mm x 50mm

Operating Temperature

-40°C to +85°C

Environment Specification

REACH & RoHS3 Compliant

THERMAL SOLUTIONS

For any highly integrated System On Modules, thermal design is very important factor. iWave Supports Heat Sink Solution for i.MX 93 SMARC SOM.

DEVELOPMENT KIT

  • Gigabit Ethernet Jack x 2
  • M.2 KEY B Connector
  • USB 2.0 Host Type-A x 2
  • USB 2.0 OTG Type
  • microAB x 1
  • Standard SD x1
  • MIPI DSI Connector
  • 20pin LVDS Connector
  • MIPI CSI Camera Connector
  • Audio In & Out Jack through I2S Codec x2
  • Full Function UART x 1
  • RTC with a backup battery
  • CAN Header x 2
  • Debug UART through
  • Micro USB Port

ENCLOSURE

The Enclosure is essential for a Devkit, iWave provides rugged Aluminium and metal sheet enclosure options which keeps the device safe whilst maintaining full access to all the major ports.

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