i.MX 8M Mini or i.MX 8M Nano SODIMM SOM

i.MX 8M Mini or i.MX 8M Nano SODIMM SOM

iW-RainboW-G34M/G37M®

  • i.MX 8M Mini Q/QL/D/DL/S/SL CPU
  • i.MX 8M Nano Q/QL/D/DL/S/SL CPU
  • 10+ years of Product Longevity Program
  • IEEE 802.11a/b/g/n/ac Wi-Fi & Bluetooth 5.0
  • Power and Cost Optimised
  • Modular & Compact SODIMM form factor 67.6mm X 37mm
  • Security Suite (Optional)
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Downloads

Documents

Design Support

Application Notes

Software

Specification

On Module Feature:

CPU

i.MX 8M Mini Quad: 4 x Cortex-A53, 1 x Cortex-M4, GPU & VPU
i.MX 8M Mini QuadLite: 4 x Cortex-A53, 1 x Cortex-M4 & GPU
i.MX 8M Mini Dual: 2 x Cortex-A53, 1 x Cortex-M4@, GPU & VPU
i.MX 8M Mini Dual Lite: 2 x Cortex-A53, 1 x Cortex-M4, GPU
i.MX 8M Mini Solo: 1 x Cortex-A53, 1 x Cortex-M4, GPU & VPU
i.MX 8M Mini Solo Lite: 1 x Cortex-A53,1 x Cortex-M4, GPU
i.MX 8M Nano Quad: 4 x Cortex-A53, 1 x Cortex-M7 & GPU
i.MX 8M Nano QuadLite: 4 x Cortex-A53 & 1 x Cortex-M7
i.MX 8M Nano Dual: 2 x Cortex-A53, 1 x Cortex-M7 & GPU
i.MX 8M Nano Dual Lite: 2 x Cortex-A53 & 1 x Cortex-M7
i.MX 8M Nano Solo: 1 x Cortex-A53, 1 x Cortex-M7 & GPU
i.MX 8M Nano Solo Lite: 1 x Cortex-A53 &1 x Cortex-M7
Memory & Storage

LPDDR4 – 1GB (Expandable Up to 4GB (mini) / 2GB (nano))
eMMC Flash – 8GB (Expandable Up to 128GB )
QSPI Flash (Optional)
Micro SD slot (Optional)

Edge Connector Features:

  • Gigabit Ethernet x1 (mini optionally support x2)
  • PCIe 2.0 x1 (Not supported in Nano)
  • USB 2.0 OTG x2 (Nano supports x1)
  • SD 3.0 x1
  • 4 lane MIPI DSI x1
  • 2 lane MIPI CSI x1
  • SAI x1 (Not supported in Nano)
  • eCSPI x3
  • I2S x1
  • I2C x2
  • UART x4 (One is optional)
  • SPDIF x1
  • PWM x2
  • JTAG x1
  • GPIOs

OS Support:

  • Linux 4.14.98
  • Android Pie 9.0.0

General Features:

Power Input

3.3V, 2A through SODIMM EDGE Connector
Form Factor

67.6mm x 37mm
Operating Temperature

-40°C to +85°C (Industrial)
0°C to +70°C (Commercial)
Environment Specification

REACH & RoHS3 Compliant
Note: Optional features are not supported in default configuration

THERMAL SOLUTIONS

Heatsink_Front
Heatspreader_Front
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For any highly integrated System On Modules, thermal design is very important factor. iWave Supports Heat Sink and Heat Spreader Solution for i.MX 8M Mini or i.MX 8M Nano SODIMM SOM.

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DEVELOPMENT KIT

  • Gigabit Ethernet Jack x1 (mini optionally support x2)
  • USB 2.0 Host Type-A x2 (Not supported in Nano)
  • USB 2.0 OTG Type-micro AB x1
  • Mini PCIe slot x1 (Not supported in Nano)
  • Micro SD x1
  • 5.5” 1080p MIPI DSI display with Capacitive Touch
  • MIPI CSI Camera Connector
  • Audio In/Out Jack through I2S Codec x1
  • Full Function UART – 1 Port
  • GPIO Header x1
  • JTAG Header x1
  • RTC with backup battery
  • Debug UART through Micro USB Port
BROCHURE
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MOUSER

MIPI DAUGHTER BOARD

iW-PREVD-03_i.MX8M Mini_Nano_SODIMM_SOM

 

  • 5.5inch MIPI DSI Display with Cap.Touch
  • One OV5640 Camera Connector
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LVDS & HDMI DAUGHTER BOARD

iW-PREVD-04_i.MX8M Mini_Nano_SODIMM_SOM_Top
iW-PREVD-04_i.MX8M Mini_Nano_SODIMM_SOM_Bottom
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  • MIPI to HDMI & LVDS conversion
  • 7-inch LVDS Display with Cap.Touch
  • HDMI TX Connector
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