i.MX 8XLite OSM – SE LGA Module

i.MX 8XLite OSM – SE LGA Module

iW-RainboW-G46M®

  • i.MX 8XLite Dual/Solo CPU with 64-bit ARMv8 Architecture
  • Up to 2GB LPDDR4 Memory
  • AEC-Q104*
  • Supports Cortex-A35 cores
  • Supports 1× 1Gb Ethernet with AVB
  • 10+ years of Product Longevity Program
  • OSM v1.0 Size-SE LGA Module

Downloads

Specification

On Module Feature:

CPU

i.MX 8XLite Dual: 2 x Cortex-A35, 1 x Cortex-MF4
i.MX 8XLite Solo: 1 x Cortex-A35, 1 x Cortex-MF4

Memory & Storage

LPDDR4 – 2GB (Expandable)
eMMC Flash – 8GB (Expandable)

OSM BGA Features:

  • RGMII x 2
  • USB 2.0 OTG x 1
  • USB 2.0 HOST x 1
  • PCIe x 1
  • CAN x 2
  • UART x 3 (1 is optional)

 

  • 18-bit RGB
  • I2S x 1
  • SPI x 1
  • I2C x 2
  • JTAG x 1
  • GPIOs

OS Support:

  • Linux 5.4.7 (or higher)
  • Android 11 (or higher)

General Features:

Power Input

5V, 2.5A through OSM BGA

Form Factor

30mm x 30mm

Operating Temperature

-40°C to +105°C

Environment Specification

REACH & RoHS3 Compliant

Note: Optional features are not supported in default configuration

THERMAL SOLUTIONS

For any highly integrated OSM Modules, thermal design is very important factor. iWave Supports Heat Sink and Heat Spreader solution for i.MX 8XLite OSM LGA Module.

OSM Based Pico ITX SBC

  • OSM based Pico ITX SBC
  • Dual 1000/100/10 Mbps Ethernet
  • CAN Header x 1
  • USB 2.0 OTG (micro AB Receptacle Connetor) x 1
  • Debug UART Header x 1
  • Audio In & Out Jack through I2S Codec x 1
  • RS232 Header x 1 (without CTS/RTS)
  • M.2 Connector Key B/M (Key M is optional)

ENCLOSURE

The Enclosure is essential for an SBC, iWave provides rugged Aluminum and metal enclosure options that keeps the device safe whilst maintaining full access to all the major ports.

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