i.MX 6 UL/ULL/ULZ SODIMM SOM

i.MX 6 UL/ULL/ULZ SODIMM SOM

iW-RainboW-G18M-SODIMM®

  • i.MX 6 UL, ULL, ULZ CPU
  • Advanced hardware enabled security
  • 10+ years of Product Longevity Program
  • Technical and quick customization support
  • Modular & Compact SODIMM form factor 67.6mm X 29mm
  • CE,FCC Certified
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Downloads

Documents

Design Support

Software

Specification

On Module Feature:

CPU

i.MX 6 UL: Cortex-A7@696MHz
i.MX 6 ULL: Cortex-A7@900MHz
i.MX 6 ULZ: Cortex-A7@900MHz
Memory & Storage

256MB DDR3 (Expandable up to 4GB)
256MB NAND Flash (Expandable)
Micro SD Slot (Optional)
eMMC Flash (Optional)
QSPI Flash (Optional)

Edge Connector Features:

  • Debug UART x 1
  • DATA UART x 3
  • CAN x 2
  • SD (4bit) x 1
  • 10/100 MBPS Ethernet x 2*(Not available in ULZ)
  • USB OTG x 2
  • 24bpp RGB Display (Not available in ULZ)
  • 8bit Parallel Camera (Not available in ULZ)
  • I2S Audio or JTAG
  • I2C x 1
  • PWM x 2
  • GPIOs

General Features:

Power Input

3.3V @ 1A through SODIMM Edge
Form Factor

67.6mm x 29mm
Operating Temperature

0°C to +70°C Commercial
-40°C to +85°C Industrial
Environment Specification

REACH & RoHS3 Compliant
Note: Optional features are not supported in default configuration.

THERMAL SOLUTIONS

Heatsink_Front
Heatspreader_Front
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For any highly integrated System On Modules, thermal design is very important factor. iWave Supports Heat Sink and Heat Spreader Solution for i.MX 6 UL,ULL & ULZ SODIMM SOM.

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DEVELOPMENT KIT

  • 10/100MBPS Ethernet Jack x 2 (Not available in ULZ)
  • USB 2.0 Host Type-A x2
  • USB 2.0 OTG Type-micro AB x1
  • 4.3″ LCD with resistive touch1
  • Resistive touch controller
  • Micro SD x1
  • Audio In/Out Jack through I2S Codec x1
  • 8Bit CSI Camera Port
  • USB Debug Port (Serial to USB conversion) x1
  • CAN Port x 1
  • Data UART Header x1
  • GPIO Header
  • JTAG Header x1 (Multiplexed with Audio)
  • RTC with backup battery
BROCHURE
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