	NXP	Xilinx	Intel PSG	Others
HPC & FPGA		Zynq ZU19/ZU17/ZU11 Zynq ZU7/ZU5/ZU4	Stratix 10 SoC Arria10 FPGA Arria10 SOC
SBC	i.MX 8M Plus i.MX8M Mini/Nano i.MX8 i.MX6	Zynq ZU5/ZU4/ZU3/ZU2 ZU19/17/11 PCIe SmartNIC Card Kintex-7 PCIe Card		Qualcomm SD820 Renesas RZ/G1C
SMARC	i.MX8M Plus i.MX8M i.MX8			Qualcomm SD820
OSM	i.MX 8XLite i.MX 8M Plus
Qseven	i.MX8 i.MX8M Mini/Nano i.MX6		Cyclone V SOM	Renesas RZ/G1H Renesas RZ/G1M TI DM8168
SODIMM	i.MX8M Mini/Nano i.MX6 i.MX6 UL/ULL	Zynq7000		Renesas RZ/G1E
COTS		PCIe Gen3 x8 FMC Module Kintex-7 3U VPX Card	Cyclone V 6U cPCI	FMC Add-On Cards

Telematics Solutions	ARINC 818 Solutions	HMI Solutions	Security Solution	Edge AI
Telematics Control Unit Rugged Telematics Device Telematics Gateway V2X Connectivity Hub J1939 Heavy Duty Logger OBD II Device J1939 Protocol Stack UDS Protocol Stack Automotive Protocol Stacks	ARINC 818 Recorder ARINC 818 Monitor ARINC 818 Tester ARINC 818 Analyser ARINC 818 to DVI Converter ARINC 818 to HDMI Converter ARINC 818 Switch IP Core ARINC 818-2 IP Core	Rugged HMI Industrial Panel PC	Security Suite OP-TEE for Android and Linux Wi-Fi Security	Edge AI Gateway Industrial IoT Gateway LoRaWAN Gateway

ARINC	sFPDP Cores	Storage Cores	Video Processing Cores	Bridge Cores	Legacy Processor Cores
ARINC 818-3 IP Core ARINC 818 Switch IP Core ARINC 818-2 IP Core ARINC 664 P7 IP	Serial FPDP (sFPDP)	NVMe Host Controller SD / SDIO Host Controller 3.0 NAND Flash Controller SD Memory Slave Controller SDIO Slave Controller SATA Host Controller eMMC Host Controller	Video DeInterlacer Color Space Conversion Chroma Resampler Alpha Blender Video Scaler	VME Slave IP Core (VME to AXI Bridge) PCI Controller PCIe to SD/MMC Bridge SDIO to UART Controller SATA 3.0 Bridge Controller	80188EB Processor 80188XL Processor 80186XL Processor 80186EC Processor 8530 Multi-Protocol Controller 8251 SCU 8254 Timer 8259A ICU 8237 DMA

i.MX 6 UL/ULL/ULZ SODIMM SOM

iW-RainboW-G18M-SODIMM®

i.MX 6 UL, ULL, ULZ CPU
Advanced hardware enabled security
10+ years of Product Longevity Program
Technical and quick customization support
Modular & Compact SODIMM form factor 67.6mm X 29mm
CE,FCC Certified

Categories: System On Modules, SODIMM Modules

Downloads

Documents

Software

Linux- User Manual
Linux – BSP

Specification

On Module Feature:

CPU	i.MX 6 UL: Cortex-A7@696MHz i.MX 6 ULL: Cortex-A7@900MHz i.MX 6 ULZ: Cortex-A7@900MHz
Memory & Storage	256MB DDR3 (Expandable up to 4GB) 256MB NAND Flash (Expandable) Micro SD Slot (Optional) eMMC Flash (Optional) QSPI Flash (Optional)

Edge Connector Features:

Debug UART x 1
DATA UART x 3
CAN x 2
SD (4bit) x 1
10/100 MBPS Ethernet x 2*(Not available in ULZ)
USB OTG x 2
24bpp RGB Display (Not available in ULZ)
8bit Parallel Camera (Not available in ULZ)
I2S Audio or JTAG
I2C x 1
PWM x 2
GPIOs

General Features:

Power Input	3.3V @ 1A through SODIMM Edge
Form Factor	67.6mm x 29mm
Operating Temperature	0°C to +70°C Commercial -40°C to +85°C Industrial
Environment Specification	REACH & RoHS3 Compliant

Note: Optional features are not supported in default configuration.

THERMAL SOLUTIONS

For any highly integrated System On Modules, thermal design is very important factor. iWave Supports Heat Sink and Heat Spreader Solution for i.MX 6 UL,ULL & ULZ SODIMM SOM.

DEVELOPMENT KIT

10/100MBPS Ethernet Jack x 2 (Not available in ULZ)
USB 2.0 Host Type-A x2
USB 2.0 OTG Type-micro AB x1
4.3″ LCD with resistive touch1
Resistive touch controller
Micro SD x1
Audio In/Out Jack through I2S Codec x1
8Bit CSI Camera Port
USB Debug Port (Serial to USB conversion) x1
CAN Port x 1
Data UART Header x1
GPIO Header
JTAG Header x1 (Multiplexed with Audio)
RTC with backup battery

iWave Systems is ISO 9001:2015 certified company, established in 1999 focuses on providing Embedded Solutions & Services for Industrial, Automotive, Medical and wide range of high end Embedded Computing Applications. Read More

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Quick Link

mktg@iwavesystems.com

Others

i.MX 6 UL/ULL/ULZ SODIMM SOM

i.MX 6 UL/ULL/ULZ SODIMM SOM

Downloads

Documents

Design Support

Software

Specification

On Module Feature:

Edge Connector Features:

General Features:

THERMAL SOLUTIONS

DEVELOPMENT KIT

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