i.MX 6 UL/ULL/ULZ SODIMM SOM

i.MX 6 UL/ULL/ULZ SODIMM SOM

iW-RainboW-G18M-SODIMM®

  • i.MX 6 UL/ULL/ULZ CPU with Arm Cortex-A7 @528MHz
  • 256MB DDR3 Expandable up to 4GB
  • Compatible with Arm Cortex-A9 i.MX 6 Q/D/S SODIMM SOM
  • Advanced hardware enabled security
  • Technical and quick customization support
  • Ultra Compact SODIMM Form Factor 67.6mm X 29mm
  • CE,FCC Certified
  • 10+ years of Product Longevity Program

SPECIFICATION

On Module Feature:

CPU

i.MX 6 UL: Cortex-A7@696MHz
i.MX 6 ULL: Cortex-A7@900MHz
i.MX 6 ULZ: Cortex-A7@900MHz

Memory & Storage

256MB DDR3 (Expandable up to 4GB)
256MB NAND Flash (Expandable)
Micro SD Slot (Optional)
eMMC Flash (Optional)
QSPI Flash (Optional)

Edge Connector Features:

  • Debug UART x 1
  • DATA UART x 3
  • CAN x 2
  • SD (4bit) x 1
  • 10/100 MBPS Ethernet x 2*(Not available in ULZ)
  • USB OTG x 2
  • 24bpp RGB Display (Not available in ULZ)
  • 8bit Parallel Camera (Not available in ULZ)
  • I2S Audio or JTAG
  • I2C x 1
  • PWM x 2
  • GPIOs

OS Support

Linux 4.1.15

General Features:

Power Input

3.3V @ 1A through SODIMM Edge

Form Factor

67.6mm x 29mm

Operating Temperature

0°C to +70°C Commercial
-40°C to +85°C Industrial

Environment Specification

REACH & RoHS3 Compliant

Note: Optional features are not supported in default configuration.

THERMAL SOLUTIONS

For any highly integrated System On Modules, thermal design is very important factor. iWave Supports Heat Sink and Heat Spreader Solution for i.MX 6 UL,ULL & ULZ SODIMM SOM.

DEVELOPMENT KIT

  • 10/100MBPS Ethernet Jack x 2 (Not available in ULZ)
  • USB 2.0 Host Type-A x2
  • USB 2.0 OTG Type-micro AB x1
  • 4.3″ LCD with resistive touch1
  • Resistive touch controller
  • Micro SD x1
  • Audio In/Out Jack through I2S Codec x1
  • 8Bit CSI Camera Port
  • USB Debug Port (Serial to USB conversion) x1
  • CAN Port x 1
  • Data UART Header x1
  • GPIO Header
  • JTAG Header x1 (Multiplexed with Audio)
  • RTC with backup battery

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