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	NXP	Xilinx	Intel PSG	Others
HPC & FPGA		Zynq ZU19/ZU17/ZU11 Zynq ZU7/ZU5/ZU4	Arria10 FPGA Arria10 SOC
SMARC	i.MX8M Plus i.MX8M i.MX8			Qualcomm SD820
Qseven	i.MX8 i.MX8M Mini/Nano i.MX6		Cyclone V SOM	Renesas RZ/G1H Renesas RZ/G1M TI DM8168
SODIMM	i.MX8M Mini/Nano i.MX6 i.MX6 UL/ULL	Zynq7000		Renesas RZ/G1E
SBC & COTS	i.MX8M Mini/Nano i.MX8 i.MX6	Zynq ZU5/ZU4/ZU3/ZU2 ZU19/17/11 PCIe SmartNIC Card PCIe Gen3 x8 FMC Module Kintex-7 3U VPX Card	Cyclone V 6U cPCI	Qualcomm SD820 Renesas RZ/G1C FMC Add-On Cards Kintex-7 PCIe Card

Telematics Solutions	ARINC 818 Solutions	HMI Solutions	Security Solution	Edge AI
Telematics Gateway Telematics Control Unit V2X Connectivity Hub J1939 Heavy Duty Logger OBD II Device J1939 Protocol Stack UDS Protocol Stack Automotive Protocol Stacks	ARINC 818 Recorder ARINC 818 Monitor ARINC 818 Tester ARINC 818 Analyser ARINC 818 to DVI Converter ARINC 818 to HDMI Converter ARINC 818 Switch IP Core ARINC 818-2 IP Core	iW-G39H HMI series iW-G38H HMI series	Security Suite OP-TEE for Android and Linux Wi-Fi Security	Corazon-AI Industrial IoT Gateway LoRaWAN Gateway

ARINC	sFPDP Cores	Storage Cores	Video Processing Cores	Bridge Cores	Legacy Processor Cores
ARINC 818-3 IP Core ARINC 818 Switch IP Core ARINC 818-2 IP Core ARINC 664 P7 IP	Serial FPDP (sFPDP)	NVMe Host Controller SD / SDIO Host Controller 3.0 NAND Flash Controller SD Memory Slave Controller SDIO Slave Controller SATA Host Controller eMMC Host Controller	Video DeInterlacer Color Space Conversion Chroma Resampler Alpha Blender Video Scaler	VME Slave IP Core (VME to AXI Bridge) PCI Controller PCIe to SD/MMC Bridge SDIO to UART Controller SATA 3.0 Bridge Controller	80188EB Processor 80188XL Processor 80186XL Processor 80186EC Processor 8530 Multi-Protocol Controller 8251 SCU 8254 Timer 8259A ICU 8237 DMA

Arria10 FPGA SOM

iW-RainboW-G24M®

Arria10 FPGA device compatibility (GX270, GX320, GX480, GX570, GX660, GX900, GX1150)
With upto 1150K Logic Elements and 24 High Speed transceivers
4-GB DDR4 RAM (64bit) & 2-GB DDR4 RAM for FPGA
24 high-speed transceivers @ 17.4Gbps
48/96 LVDS from BANK 3B & 3C and 93 SE from BANK 2A & 3A
Dual 240 Pin Board to Board Connector
Variable IO voltage support from PMIC
Industrial Grade operation
10+ Years Longevity

Categories: System On Modules, FPGA Modules

Downloads

Specification

On Module Feature:

Compatible Arria10 FPGA Family – GX270, GX320, GX480, GX570, GX660, GX900, GX1150
- Up to 1150K Logic elements
- High Speed Transceivers x 24 @ 17.4 Gbps
2-GB DDR4 RAM (32bit) from FPGA
4-GB DDR4 RAM (64bit) from FPGA (only in GX480 or higher family devices)
Configuration Flash for FPGA
Other On SOM features
- JTAG Header
- 5V-FAN Header
- FPGA AS Header
- FPGA Configuration Selection Switch

Two 240pin High Speed Board to Board Connectors Interfaces

From connector 1 interface	FPGA High Speed Transceivers (upto 17.4Gbps) x 16 FPGA IOs & General Purpose Clocks – Bank2A Up to 21 LVDS/46SE IOs One General Purpose Clock Input LVDS Pair/Single Ended Two General Purpose Clock Output LVDS Pairs/Single Ended FPGA IOs & General Purpose Clocks – Bank3A Up to 22 LVDS/47SE IOs Two General Purpose Clock Input LVDS Pairs/Single Ended Two General Purpose Clock Output LVDS Pairs/Single Ended
From connector 2 interface	Gigabit Ethernet x 1 Port (through On-SOM Gigabit Ethernet PHY from Bank2L IOs) USB OTG x 1 Port (through On-SOM USB ULPI PHY from Bank2L IOs) Upto 20 Single-Ended IOs FPGA AS Interface (Optional) FPGA High-Speed Transceivers (up to 17.4Gbps) x 8 FPGA IOs & General Purpose Clocks – Bank3B Up to 24 LVDS IOs/48SE IOs Two General Purpose Clock Input LVDS Pairs/Single Ended Two General Purpose Clock Output LVDS Pairs/Single Ended FPGA IOs & General Purpose Clocks – Bank3C Up to 24 LVDS IOs/48SE IOs Two General Purpose Clock Input LVDS Pairs/Single Ended Two General Purpose Clock Output LVDS Pairs/Single Ended JTAG Interface

From connector 1 interface

FPGA High Speed Transceivers (upto 17.4Gbps) x 16
FPGA IOs & General Purpose Clocks – Bank2A

- Up to 21 LVDS/46SE IOs
- One General Purpose Clock Input LVDS Pair/Single Ended
- Two General Purpose Clock Output LVDS Pairs/Single Ended
FPGA IOs & General Purpose Clocks – Bank3A
- Up to 22 LVDS/47SE IOs
- Two General Purpose Clock Input LVDS Pairs/Single Ended
- Two General Purpose Clock Output LVDS Pairs/Single Ended

From connector 2 interface

Gigabit Ethernet x 1 Port (through On-SOM Gigabit Ethernet PHY from Bank2L IOs)
USB OTG x 1 Port (through On-SOM USB ULPI PHY from Bank2L IOs)
Upto 20 Single-Ended IOs
FPGA AS Interface (Optional)
FPGA High-Speed Transceivers (up to 17.4Gbps) x 8
FPGA IOs & General Purpose Clocks – Bank3B
- Up to 24 LVDS IOs/48SE IOs
- Two General Purpose Clock Input LVDS Pairs/Single Ended
- Two General Purpose Clock Output LVDS Pairs/Single Ended
FPGA IOs & General Purpose Clocks – Bank3C
- Up to 24 LVDS IOs/48SE IOs
- Two General Purpose Clock Input LVDS Pairs/Single Ended
- Two General Purpose Clock Output LVDS Pairs/Single Ended
JTAG Interface

General Features:

Power Input	5V
Operating Temperature	-40°C to +85°C
Form Factor	75mm x 95mm
Environment Specification	RoHS &REACH Compliant
Compliance	CE*

THERMAL SOLUTIONS

For any highly integrated System On Modules, thermal design is very important factor. iWave Supports Heat Sink and Fan Sink Solution for Arria10 SoC FPGA SOM.

DEVELOPMENT KIT – DUAL FMC

Gigabit Ethernet through RJ45MagJack x 1
USB2.0 OTG through Micro AB connector x 1
Debug UART through USB Micro AB connector x 1
10G Ethernet through SFP+ Connector
PCIe Gen3 x 1 Connector
Dual PMOD Connector
Dual FMC High Pin Count (HPC) Connector
SDI Video IN through HD BNC Connector x 1
SDI Video Out through HD BNC Connector x 1
M.2 SATA Connector x 1
USB3.0 TypeC connector x 1
Display Port Connector x 1
Clock Synthesizer/Generator
16-Bit IO Expander
JTAG Connector x 1
20 Pin GPIO Header x 1
RTC Coin Cell Holder
Power ON/OFF DIP Switch x 1
Reset Push button Switch x 1
Power Supply : DC 12V, 5A Power Input Jack
Form Factor: 130mm x 140mm

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Arria10 FPGA SOM

Arria10 FPGA SOM

Downloads

Documents

Design Support

Application Notes

Software

Specification

On Module Feature:

Two 240pin High Speed Board to Board Connectors Interfaces

General Features:

THERMAL SOLUTIONS

DEVELOPMENT KIT – DUAL FMC

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