Zynq UltraScale+ RFSoC SOM

Zynq UltraScale+ RFSoC SOM

iW-RainboW-G42M®

  • Zynq Ultrascale+ RFSoC family with FFVF1760 Package
    • Compatible with ZU49/ZU39/ZU29DR device
  • Dual 400 Pin Board to Board connectors with
    • 16 ADC Channels support up to 2.5Gsps
    • 16 DAC Channels support up to 10Gsps
    • 16 GTY Transceivers support up to 28.21Gbps
    • Up to 188 FPGA IOs
  • Integrated ultra low-noise programmable RF PLL
  • Integrated SyncE & PTP Network Synchronization
  • Industrial Grade Availability
  • 10+ Years Longevity Support

On Module Features:

Zynq Ultrascale+ RFSoC
  • ZU49/ZU39/ZU29DR
  • Processing System (PS)
    • Quad Arm Cortex-A53 @1.3GHz,
    • Dual Cortex-R5F @533MHz
  • Programming Logic (PL)
    • Up to 930 Logic cells & 425K LUTs
    • PL GTY High Speed Transceivers x 16 @28.21 Gbps
Memory
  • 64bit, 8GB DDR4 RAM with ECC for PS (Upgradable upto 34GB)
  • 64bit, 8GB DDR4 RAM for PL
  • 32GB eMMC Flash (Upgradable)
  • 256MB QSPI Flash

Board to Board Connector1 Interfaces (400pin):

ADC

16 x ADC Channels up to 2.5Gsps

DAC

16 x DAC Channels up to 10Gsps

PL IOs

PL IOs – 188 IOs

    • HP Bank IOs – up to 70LVDS/140SE
    • HD Bank IOs – up to 24LVDS/48SE

Board to Board Connector2 Interfaces (400pin):

From PL Block
  • 16 x PL-GTY High Speed Transceivers (up to 28.21Gbps)
  • PL Control Signal
From PS Block
  • Gigabit Ethernet x 1 Port (through On-SOM Gigabit Ethernet PHY)
  • USB 2.0 OTG x 1 (through On-SOM USB2.0 transceiver)
  • SPI/QSPI X 1 Port(Optional)
  • CAN x 1
  • I2C x 2
  • SD x 1
  • Debug UART x 1
  • Data UART x 1
  • PS JTAG
  • RGMII Interface or ULPI Interface x 1
  • PS -GTR High speed Transceivers x 4 (upto 6Gbps)
  • PS-Control Signals
  • SYSMON(Optional)
Clock signals
  • 10MHz Clock IN
  • 1 PPS IN
  • 10 MHz Clock out
  • 1 PPS Clock Out
  • Synthesized Clock out from Clock synthesizer
  • Synthesized Clock Into Clock Synthesizer

General Features:

Power Input

12V through B2B Connector2

Form Factor

100mm x 90mm(BRYN)

BSP Support

Linux BSP:- Petalinux/vivado 2022.1

Operating Temperature

-40°C to +85°C (Industrial Grade)

Environment Specification

REACH & RoHS3 Compliant

Compliance

CE*

DEVELOPMENT KIT

RF DAC/ADC Specifications:

  • 8 RF RT SMA connectors with Balun(BW-800MHz-1GHz) 
  • 8 RF ST SMA connectors with Balun(BW-800MHz-1GHz)
  • 8RF ST SMA connectors with Balun(BW-700MHz-1.6GHz) 
  • 8 RF ST SMA connectors with Balun(BW-10MHz-3GHz) 

High Speed and Interface Specifications:

  • PCIe Gen3 x8 Edge Connector.
  • FMC+ High Pin count(HPC) connector
  • 4 SMA Straight angled connector for Clocks(10Mhz, 1PPS, SYS-CLK IN/Out)
  • NVMe PCIe Gen2 x2 M.2 Connector
  • Gigabit Ethernet through RJ45MagJack
  • Debug & DATA UART/JTAG through Type-C Connector
  • Operating Temperature: -30°C to +85°C
  • Form Factor : 254mm x 111.15mm (3/4 Length PCIe Card)

Custom Design Sevices

iWave provides end-to-end ODM services, from concept to production, leveraging our in-house expertise in hardware design, software development, FPGA design, and mechanical enclosure design. The FPGA expertise at iWave includes RTL, high speed bus interface and transceivers, storage, video, networking, and high-speed ADC/DAC with the entire product lifecycle, from initial concept to mass production and ongoing support.

THERMAL SOLUTIONS

For any highly integrated System on Modules, thermal design is very important factor. iWave Supports heat Spreader and Fan Sink solution for RFSoC based SOM.

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