Zynq UltraScale+ RFSoC SOM

Zynq UltraScale+ RFSoC SOM


  • Zynq Ultrascale+ RFSoC family with FFVF1760 Package
    • Compatible with ZU49/ZU39/ZU29DR device
  • Dual 400 Pin Board to Board connectors with
    • 16 ADC Channels support up to 2.5Gsps
    • 16 DAC Channels support up to 10Gsps
    • 16 GTY Transceivers support up to 28.21Gbps
    • Up to 188 FPGA IOs
  • Integrated ultra low-noise programmable RF PLL
  • Integrated SyncE & PTP Network Synchronization
  • Industrial Grade Availability
  • 10+ Years Longevity Support


On Module Features:

Zynq Ultrascale+ RFSoC
  • ZU49/ZU39/ZU29DR
  • Processing System (PS)
    • Quad Arm Cortex-A53 @1.3GHz,
    • Dual Cortex-R5F @533MHz
  • Programming Logic (PL)
    • Up to 930 Logic cells & 425K LUTs
    • PL GTY High Speed Transceivers x 16 @28.21 Gbps
  • 64bit, 8GB DDR4 RAM with ECC for PS (Upgradable upto 34GB)
  • 64bit, 8GB DDR4 RAM for PL
  • 32GB eMMC Flash (Upgradable)
  • 256MB QSPI Flash

Board to Board Connector1 Interfaces (400pin):


16 x ADC Channels up to 2.5Gsps


16 x DAC Channels up to 10Gsps


PL IOs – 188 IOs

    • HP Bank IOs – up to 70LVDS/140SE
    • HD Bank IOs – up to 24LVDS/48SE

Board to Board Connector2 Interfaces (400pin):

From PL Block
  • 16 x PL-GTY High Speed Transceivers (up to 28.21Gbps)
  • PL Control Signal
From PS Block
  • Gigabit Ethernet x 1 Port (through On-SOM Gigabit Ethernet PHY)
  • USB 2.0 OTG x 1 (through On-SOM USB2.0 transceiver)
  • SPI/QSPI X 1 Port(Optional)
  • CAN x 1
  • I2C x 2
  • SD x 1
  • Debug UART x 1
  • Data UART x 1
  • RGMII Interface or ULPI Interface x 1
  • PS -GTR High speed Transceivers x 4 (upto 6Gbps)
  • PS-Control Signals
  • SYSMON(Optional)
Clock signals
  • 10MHz Clock IN
  • 1 PPS IN
  • 10 MHz Clock out
  • 1 PPS Clock Out
  • Synthesized Clock out from Clock synthesizer
  • Synthesized Clock Into Clock Synthesizer

General Features:

Power Input

12V through B2B Connector2

Form Factor

90mm x 100mm(BRYN)

BSP Support

Linux BSP:- Petalinux/vivado 2022.2

Operating Temperature

-40°C to +85°C (Industrial Grade)

Environment Specification

REACH & RoHS3 Compliant




For any highly integrated System on Modules, thermal design is very important factor. iWave Supports heat Spreader and Fan Sink solution for RFSoC based SOM.


RF DAC/ADC Specifications:

  • 8 RF RT SMA connectors with Balun(BW-800MHz-1GHz) 
  • 8 RF ST SMA connectors with Balun(BW-800MHz-1GHz)
  • 8RF ST SMA connectors with Balun(BW-700MHz-1.6GHz) 
  • 8 RF ST SMA connectors with Balun(BW-10MHz-3GHz) 

High Speed and Interface Specifications:

  • PCIe Gen3 x8 Edge Connector.
  • FMC+ High Pin count(HPC) connector
  • 4 SMA Straight angled connector for Clocks(10Mhz, 1PPS, SYS-CLK IN/Out)
  • NVMe PCIe Gen2 x2 M.2 Connector
  • Gigabit Ethernet through RJ45MagJack
  • Debug & DATA UART/JTAG through Type-C Connector
  • Operating Temperature: -30°C to +85°C
  • Form Factor : 254mm x 111.15mm (3/4 Length PCIe Card)


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