Zynq UltraScale+ RFSoC SOM

Zynq UltraScale+ RFSoC SOM

iW-RainboW-G42M

  • Zynq Ultrascale+ RFSoC family with FFVF1760 Package
  • Compatible with ZU49/ZU39/ZU29DR device
  • Quad ARM Cortex-A53 @ 1.3GHz,Dual Cortex-R5F @533MHz
  • Memory Bandwidth;
    • 64bit, 8GB PS DDR4 RAM with ECC
    • 64bit, 8GB PL DDR4 RAM
  • Integrated ultra low-noise programmable RF PLL
  • Integrated SyncE & PTP Network Synchronization
  • Dual 400 Pin Board to Board connectors with
    • 16 ADC Channels support up to 2.5Gsps
    • 16 DAC Channels support up to 10Gsps
    • 16 GTY Transceivers support up to 28.21Gbps
    • Up to 188 FPGA IOs
  • Industrial Grade Availability
  • 10+ Years Longevity Support

Downloads

Specification

On Module Features:

  • ZU49/ZU39/ZU29DR – Zynq Ultrascale+ RFSoC
  • Processing System (PS)
    • Quad Arm Cortex-A53 @1.3GHz,
    • Dual Cortex-R5F @533MHz
  • Programming Logic (PL)
    • Up to 930 Logic cells & 425K LUTs
    • PL GTY High Speed Transceivers x 16 @28.21 Gbps
  • 64bit, 8GB DDR4 RAM with ECC for PS (Upgradable upto 34GB)
  • 64bit, 8GB DDR4 RAM for PL
  • 32GB eMMC Flash (Upgradable)
  • 256MB QSPI Flash
  • RGMII Ethernet PHY Transceiver
  • USB2.0 ULPI Transceiver

 

Board to Board Connector1 Interfaces (400pin):

  • PL IOs – 188 IOs
    • HP Bank IOs – up to 70LVDS/140SE
    • HD Bank IOs – up to 24LVDS/48SE
  • 16 x ADC Channels up to 2.5Gsps
  • 16 x DAC Channels up to 10Gsps

Board to Board Connector2 Interfaces (400pin):

From PL Block
  • 16 x PL-GTY High Speed Transceivers (up to 28.21Gbps)
  • PL Control Signal
From PS Block
  • Gigabit Ethernet x 1 Port (through On-SOM Gigabit Ethernet PHY)
  • USB 2.0 OTG x 1 (through On-SOM USB2.0 transceiver)
  • SPI/QSPI X 1 Port(Optional)
  • CAN x 1
  • I2C x 2
  • SD x 1
  • Debug UART x 1
  • Data UART x 1
  • PS JTAG
  • RGMII Interface or ULPI Interface x 1
  • PS -GTR High speed Transceivers x 4 (upto 6Gbps)
  • PS-Control Signals
  • SYSMON(Optional)
Clock signals
  • 10MHz Clock IN
  • 1 PPS IN
  • 10 MHz Clock out
  • 1 PPS Clock Out
  • Synthesized Clock out from Clock synthesizer
  • Synthesized Clock Into Clock Synthesizer

General Features:

Power Input

12V through B2B Connector2

Form Factor

90mm x 100mm(BRYN)

BSP Support

Linux BSP:- Petalinux/vivado 2022.2

Operating Temperature

-40°C to +85°C (Industrial Grade)

Environment Specification

REACH & RoHS3 Compliant

Compliance

CE*

THERMAL SOLUTIONS

For any highly integrated System on Modules, thermal design is very important factor. iWave Supports heat Spreader and Fan Sink solution for RFSoC based SOM.

DEVELOPMENT KIT

RF DAC/ADC Specifications:

  • 8 RF RT SMA connectors with Balun(BW-800MHz-1GHz) 
  • 8 RF ST SMA connectors with Balun(BW-800MHz-1GHz)
  • 8RF ST SMA connectors with Balun(BW-700MHz-1.6GHz) 
  • 8 RF ST SMA connectors with Balun(BW-10MHz-3GHz) 

High Speed and Interface Specifications:

  • FMC+ High Pin count(HPC) connector
  • 4 SMA Straight angled connector for Clocks(10Mhz, 1PPS, SYS-CLK IN/Out)
  • PCIe Gen2 x8 Edge Connector.
  • NVMe PCIe Gen2 x2 M.2 Connector
  • Display Port(DP) USB Type-C Connector
  • Gigabit Ethernet through RJ45MagJack
  • Micro SD Connector
  • USB2.0 OTG through Type-C Connector
  • Debug & DATA UART/JTAG through Type-C Connector
  • Operating Temperature: -30°C to +85°C
  • Form Factor : 254mm x 111.15mm (3/4 Length PCIe Card)

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