i.MX6 SODIMM Top-min

i.MX6 SODIMM Bottom-min

i.MX 6 SODIMM SOM

i.MX 6 SODIMM SOM

iW-RainboW-G15M-SODIMM®

i.MX 6 Q/D/DL/S Core CPU
Multi format HD 1080p encode & decode
2D/3D Hardware Graphics Acceleration
10+ years of Product Longevity Program
1000/100/10 Mbps Ethernet
Modular & Compact SODIMM form factor 67.6mm X 37mm

Categories: System On Modules, SODIMM Modules

Downloads

Documents

Mechanical

Linux & Android

Linux- User Manual
Linux – BSP
Android - User Manual
Android - BSP

Specification

On Module Feature:

CPU	i.MX 6 Quad: 4 x Cortex-A9, GPU & VPU i.MX 6 Dual: 2 x Cortex-A9, GPU & VPU i.MX 6 Dual Lite: 2 x Cortex-A9, GPU & VPU i.MX 6 Solo: 1 x Cortex-A9, GPU & VPU
Memory & Storage	1GB DDR3 for Q/D/DL SOM (Expandable up to 4GB) 512MB DDR3 for Solo SOM (Expandable up to 2GB) eMMC Flash – 4GB (Expandable upto 128GB) SPI Flash – 2MB(Expandable)

Edge Connector Features:

PCIe x 1
SATA x 1 (Not available in DL and S CPUs)
USB2.0 HOST x 1
USB2.0 OTG x 1
Gigabit Ethernet x 1
UART x 3
24bpp RGB LCD x 1
8bit Camera CSI x 1
LVDS x 1
HDMI 1.4 x 1
4bit SD x 1
I2S x 1I2C x 2
PWM x 4
Debug UART x 1
JTAG x 1

General Features:

Power Input	3.3V, 4A through SODIMM EDGE Connector
Form Factor	70mm x 70mm
Operating Temperature	-40°C to +85°C (Industrial)
Environment Specification	REACH & RoHS3 Compliant

THERMAL SOLUTIONS

For any highly integrated System On Modules, thermal design is very important factor. iWave Supports Heat Sink and Heat Spreader Solution for i.MX 6 SODIMM SOM.

DEVELOPMENT KIT

Gigabit Ethernet Jack x1
USB 2.0 Host Type-A x2
USB 2.0 OTG Type-micro AB x1
Micro SD x1
USB Debug Port (Serial to USB conversion) x1
Data UART Header x1
CAN Port x 1
Mini PCIe slot x1
SATA x 1 (Not available in DL and S CPUs)
Audio In/Out Jack through I2S Codec x1
Parallel Camera support
HDMI x 1
LVDS x 1
JTAG Header x1
RTC with backup battery

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