ZU15/ZU9/ZU6- Zynq UltraScale+ MPSoC System on Module

ZU15/ZU9/ZU6- Zynq UltraScale+ MPSoC System on Module

iW-RainboW-G65M®

  • AMD Xilinx’s ZU15/9/6 Compatible Zynq Ultrascale+ MPSoC SOM
  • 64bit, 4GB PS DDR4 RAM with ECC (Upgradable)
  • 16 bit, 1GB PL DDR4 RAM (Upgradable)
  • 16 High-Speed Transceiver lanes (Up to 16.3Gb/s)
  • 4 PS GTR Transceiver Lanes (Up to 6Gb/s)
  • 8GB eMMC Flash (Upgradable)
  • On-SOM Gigabit Ethernet PHY & USB2.0 transceiver
  • RGMII Interface or ULPI Interface x 1

On Board Features:

ZU15EG ZU9/6 EG/CG - Zynq Ultrascale+ MPSoC (FFVC900)

Processing System (PS/Processor)

  • Quad-core ARM Cortex-A53 MPCore @1.5GHz
  • Dual-core ARM Cortex-R5 MPCore @600MHz
  • Arm Mali-400MP2 GPU

Programming Logic (PL/FPGA)

  • Upto 747K Logic cells & 341K LUTs
  • High Speed GTH Transceivers x 16 (Upto 16.3Gb/s)

 

RAM Memory
  • PS: 64bit, 4GB DDR4 RAM with ECC (Expandable upto 8GB)
  • PL/FPGA: 16bit, 1GB DDR4 RAM (Expandable upto 2GB)
On Board Flash
  • 8GB eMMC Flash for boot & storage (expandable up to 128GB)
  • EEPROM (4Kbit)

     

Other Interfaces
  • Gigabit Ethernet PHY Transceiver (PTP supported)
  • USB2.0 PHY Transceiver
  • 6 Output programable clock synthesizer

240pin High-Speed Board to Board Connector 1 Interfaces

From PS Block
  • PS GTR Transceiver Lanes x 2 (Up to 6.0Gb/s)
  • GEM3 RGMII Interface or ULPI Interface x 1
  • CAN interface x2
From PL Block
  • High Speed GTH Transceiver Lanes x 12 (Up to 16.3Gbps)
  • HD Bank IOs – Up to 23LVDS/46 Single Ended IO’s
  • ADC Input pins- Up to 20 Differential/Single Ended from HD Banks

240pin High-Speed Board to Board Connector 2 Interfaces

From PS Block
  • PS GTR Transceiver Lanes x 2 (Up to 6.0Gb/s)
  • Gigabit Ethernet x 1 Port (through On-SOM Gigabit Ethernet PHY)
  • USB2.0 OTG x 1 Port (through On-SOM USB2.0 transceiver)
  • SD (4bit) x 1
  • Debug UART & Data UART x 1
  • SPI x 1
  • I2C x 2 Port
  • JTAG x 1
From PL Block
  • High Speed GTH Transceiver Lanes x 4 (Up to 16.3Gbps)
  • HP Bank IOs – 48 LVDS/96 Single Ended IO’s
  • ADC Input pins – Up to 32 Differential/Single Ended from HP Banks

General Specification

Power Supply

+5VDC +/- 5% input from Board-to-Board Connector 2

Form Factor

95mm X 75mm

Environment Specification

RoHS & REACH Compliant

Compliance

CE*

Notes:
*Under Progress

DEVELOPMENT KIT

ZU15EG ZU9/6 EG/CG Devkit image
  • 10G Ethernet through SFP+ Connector
  • 3G SDI Video IN through HD BNC Connector
  • 3G SDI Video OUT through HD BNC Connector
  • Dual FMC High Pin Count (HPC) Connector
  • DP1.2a Display Port Connector
  • PCIe Gen2 x4 Connector
  • M.2 SATA 3.1 Connector
  • Dual Gigabit Ethernet through RJ45MagJack
  • USB2.0 OTG through Micro-AB Connector
  • USB 2.0 OTG through TypeC Connector
  • USB 3.0 through TypeC connector
  • Standard SD Connector
  • CAN Header
  • Dual PMOD Connector
  • JTAG Header
  • RTC Coin Cell Holder
  • Operating Temperature: -20°C to +85°C
  • Form Factor: 130mm x 140mm

Custom Design Sevices

iWave provides end-to-end ODM services, from concept to production, leveraging our in-house expertise in hardware design, software development, FPGA design, and mechanical enclosure design. The FPGA expertise at iWave includes RTL, high speed bus interface and transceivers, storage, video, networking, and high-speed ADC/DAC with the entire product lifecycle, from initial concept to mass production and ongoing support.

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