Zynq UltraScale+ RFSoC ZU48/ZU47/ZU43/ZU28/ZU27/ZU25DR

Zynq UltraScale+ RFSoC ZU48/ZU47/ZU43/ZU28/ZU27/ZU25DR

iW-RainboW-G60M®

  • ZynqTM Ultrascale+TM RFSoC family with FFVG1517 Package
  • Compatible with ZU48/ZU47/ZU43/ZU28/ZU27/ZU25DR devices
  • 8GB DDR4 RAM for PS with ECC & 8GB DDR4 RAM for PL
  • 32GB eMMC Flash Expandable up to 128GB & 256MB QSPI Flash
  • Integrated SD-FEC IP Block
  • Up to 930K Logic cells & 425K LUTs

On Module Features:

SoC

ZU48/ZU47/ZU43/ZU28/ZU27/ZU25DR
Processing System (PS)

  • Quad Arm Cortex-A53 up to 1.3GHz
  • Dual Cortex-R5F up to 533MHz

Programming Logic (PL)

  • Up to 930K Logic cells & 425K LUTs
  • PL GTY High Speed Transceivers x 16 @28.21 Gbps
Memory
  • 64bit, 8GB DDR4 RAM for PS with ECC
  • 64bit, 8GB DDR4 RAM for PL
Storage
  • 32GB eMMC Flash Expandable up to 128GB
  • 256MB QSPI Flash

Board to Board Connector1 Interfaces (400pin)

ADC

8 x ADC Channels up to 5Gsps

DAC

8 x DAC Channels up to 9.85Gsps

PL IOs

PL IOs – 169 IOs

  • HP Bank IOs – Up to 70LVDS/140SE
  • HD Bank IOs – Up to 12LVDS/29SE

Board to Board Connector2 Interfaces (400pin)

From PL Block
  • 16 x PL-GTY High Speed Transceivers (up to 28.21Gbps)
  • PL Control Signal
From PS Block
  • Gigabit Ethernet x 1 Port (through On-SOM Gigabit Ethernet PHY)
  • USB 2.0 OTG x 1 (through On-SOM USB2.0 transceiver)
  • SPI/QSPI X 1 Port (Optional)
  • CAN x 1, I2C x 2, SD x 1
  • Debug UART x 1, Data UART x 1, PS JTAG
  • RGMII Interface or ULPI Interface x 1
  • PS -GTR High speed Transceivers x 4 (upto 6Gbps)
  • PS-Control Signals
  • SYSMON(Optional)
Clock Signals
  • 10MHz Clock IN, 1 PPS IN
  • 10 MHz Clock out, 1 PPS Clock Out

General Features

Power Input

12V through B2B Connector2

Form Factor

82mm x 100mm (BRYNc)

BSP Support

Linux BSP- Petalinux/Vivado 2024.1

Operating Temperature

-40°C to +85°C (Industrial)

Environment Specification

REACH & RoHS3 Compliant

Compliance

CE*

DEVELOPMENT KIT

ADC Channels (Up to x8):

  • 1 x Right Angle SMA connector on Front Panel with Balun (BW 10MHz To 3GHz)
  • Up to 3 x Right Angle SMA connectors on Front Panel with Balun (BW 3.1GHz To 5.8GHz)
  • 1 x Straight SMA connectors with Balun (BW 10MHz To 3GHz)
  • Up to 3x Straight SMA connectors with Balun (BW 3.1GHz To 5.8GHz)

DAC Channels (Up to x8):

  • 1 x Right Angle SMA connector on Front Panel with Balun (BW 10MHz To 3GHz)
  • Up to 3 x Right Angle SMA connectors on Front Panel with Balun (BW 3.1GHz To 5.8GHz)
  • 1 x Straight SMA connectors with Balun (BW 10MHz To 3GHz)
  • Up to 3x Straight SMA connectors with Balun (BW 3.1GHz To 5.8GHz)

High Speed and Interface Specifications:

  • PCIe x8 Edge Connector Up to Gen4 for high-throughput streaming
  • FMC+ High Pin Count (HPC) expansion connector support
  • External clocking interfaces for SYSREF, reference clock, and synchronization
  • Debug & DATA UART/JTAG through onboard programming interface

Custom Design Sevices

iWave provides end-to-end ODM services, from concept to production, leveraging our in-house expertise in hardware design, software development, FPGA design, and mechanical enclosure design. The FPGA expertise at iWave includes RTL, high speed bus interface and transceivers, storage, video, networking, and high-speed ADC/DAC with the entire product lifecycle, from initial concept to mass production and ongoing support.

THERMAL SOLUTIONS

For any highly integrated System on Modules, thermal design is very important factor. iWave Supports heat Spreader and Fan Sink solution for RFSoC based SOM.

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