Versal™ AI Edge Gen2 3U VPX Plug-in Module (Payload Profile)

Versal™ AI Edge Gen2

SoC	Compatible with 2VE3858/3804/3558/3504 Devices 8x Arm Cortex- A78AE and 10x Cortex R52 Supports AIE-ML v2 up to 144 Tiles Up to 1188K Logic cells and 543K LUTs
Memory & Storage	32bit, 4GB LPDDR5x from PS (Upgradable) Three 32bit, 4GB LPDDR5x from PL (Upgradable) 256MB OSPI Flash and 32GB eMMC Flash
IPMC	Arm® 32-bit Cortex®-M0+ CPU up to 80 MHz On chip 64KB of flash and 4KB of SRAM One 12-bit 1.68-MSPS analog-to-digital converter (ADC)

VPX Front Panel features

Gigabit Ethernet Header
USB3.0 Type-C
3-pin Debug UART Header
Display Port
ADC x4 & DAC x4; Sampling rate up to 1.6GSPS¹

VPX On board features

On Board Clock Generators
Temperature Sensor x1
Elapse Counter x1
EEPROM x1

3U VPX Backplane

Connector – P0	Utility Plane System Control Signals (GA[0:4], P, SYSRESET, NVMRO) System Reference Clocks (REF_CLK, AUX_CLK) IPMB-A, B & JTAG Power Input (12V VDC, 3.3V_AUX)
Connector – P1A +P1B	Data Plane Port-01 DP01[3:0] – 40G Ethernet Data Plane Port DPutp01 – 10G Ethernet Control Plane Port CPutp01 – 10G Ethernet Expansion Plane Port EP[0:3] – PCIe Gen3 x1 EP[4:7] – 40G Ethernet System Control Signals (Maskable Reset, SysCON, GDiscrete) Maintenance Port MP01 & MP02 Power Input (VBAT)
Connector – P2A	User defined Port EP[8:15] – GPLVDS 8 lanes
Aperture Pattern J – P2B	MT Ferrule Module – MM12F – 12 Fibre ports NanoRF -10 ADC x4 & DAC x4; Sampling rate up to 1.6GSPS¹

Profile Specification

Profile	SLT3-PAY-1F1U1S1S1U1U4F1J-14.6.13-4
Module Profile as per AMPS	MODA3p-16.6.13-1-4-F2C-(E8-E7) (P3F – N, 16G2) (E7) (N-G2) [E12]

General Specification

Slot Pitch	1 inch Conduction Cooled
BSP Support	Linux
Environment Specification	RoHS & REACH Compliant

¹ADC x4 & DAC x4 will be either supported in Front panel or Backplane

Custom Design Sevices

iWave provides end-to-end ODM services, from concept to production, leveraging our in-house expertise in hardware design, software development, FPGA design, and mechanical enclosure design. The FPGA expertise at iWave includes RTL, high speed bus interface and transceivers, storage, video, networking, and high-speed ADC/DAC with the entire product lifecycle, from initial concept to mass production and ongoing support.

Product Design Process

Certification & Qualification

Product Lifecycle Management

Mechanical Services

THERMAL SOLUTIONS

Thermal design is a crucial factor for highly integrated System on Modules. iWave offers Heat Sink solutions for Versal AI Edge Gen2 based SoMs to ensure optimal thermal management.

AMD

ALTERA

ACHRONIX

MIL/Space Grade

NXP

MEDIATEK

TI

ST

RENESAS

PCIe CARDS

VPX CARDS

FMC CARDS

PCIe Cards

VPX Cards

FMC Cards

Documents

Design Support

Software

Documents

Design Support

Software

Versal™ AI Edge Gen2 3U VPX Plug-in Module (Payload Profile)

Versal™ AI Edge Gen2 3U VPX Plug-in Module (Payload Profile)

Versal™ AI Edge Gen2

VPX Front Panel features

VPX On board features

3U VPX Backplane

Profile Specification

General Specification

Custom Design Sevices

THERMAL SOLUTIONS

Related products

Versal AI Edge Gen2

Versal AI Edge/Prime SOM

Versal™ AI Edge/Prime 3U VPX Plug-in Module (Payload Profile)

Versal™ Prime Gen2 3U VPX Plug-in Module (Payload Profile)

RELATED VIDEOS

Related products

Versal AI Edge Gen2

Versal™ Prime Gen2 3U VPX Plug-in Module (Payload Profile)

Versal AI Edge/Prime SOM

Versal™ AI Edge/Prime 3U VPX Plug-in Module (Payload Profile)

Related News

Unlocking the Potential of Agilex 5 System on Module in AI Development

FPGA System Design: Why Choose FPGA SoM for Optimal FPGA System Design

Case Study: Design Secure Communication Systems based on Intel Arria 10 SoCs

Subscribe to iWave Newsletter