• Dual-core Arm Cortex-A72 APU @1.3GHz
• Dual-core Arm Cortex-R5F RPU @600MHz
• Compatible with XQRVE2302 devices
• Up to 329K System Logic Cells & 150.272K LUTs
• 34 AIE-ML Tiles with 68Mb AIE-ML Shared Memory
• TID: Maximum of up to 120 krad (Si)
• SEL: Up to 80 MeV.cm²/mg
• SEU:

For GEO:

• SEU_CRAM – 6.5×10^–12Event/bit/day
• SEU_BRAM – 9.4 x 10^–10Event/bit/day
• SEU_URAM – 1.8 x 10^–10Event/bit/day

For LEO:

• SEU_CRAM – 3.5 x 10^–9Event/bit/day
• SEU_BRAM – 1.2 x 10^–7Event/bit/day
• SEU_URAM – 2.9 x 10^–8Event/bit/day

• 64-bit, 4GB DDR4 (up to 8GB)
• 4Mb EEPROM

• 32GB eMMC Flash (up to 256GB)
• 64MB QSPI Flash (up to 128MB)

• Select MAP (8-bit) x1
• GEM0 10/100/1000Mbps Ethernet x1
• GEM1 RGMII x1
• SD1 (4-bit) x1
• Debug UART x1
• JTAG x1
• SPI (3CS) x1
• CAN FD x1
• PMC I2C x1

5V through B2B Connector

REN

Linux/Vivado 2024 or above

-55°C to +125°C

30krad (Si)

43MeV.cm²/mg

60MeV.cm²/mg

MIL-STD-883E Group – B, D & E Compliant