Renesas G2UL or G2LC based OSM-SE LGA Module

Renesas G2UL or G2LC based OSM-SE LGA Module


The data provided is Preliminary and Subject to Change

  • Renesas G2UL or G2LC SoC with 64-bit ARMv8.2 A Architecture
  • Up to 4GB LPDDR4 Memory (based on chip availability)
  • Supports Cortex-A55 cores
  • Supports Cortex-M33 core for RTOS (G2LC)
  • Supports 1× RGMII
  • 10+ years of Product Longevity Program
  • OSM v1.1 Size-SE LGA Module

On Module Feature:


RZ/G2UL : 1 x Arm® Cortex®-A55 (1.0GHz)

RZ/G2LC : 2 x Arm® Cortex®-A55 (1.0GHz)

1 x Arm® Cortex®-M33 (200MHz)

Memory & Storage

DDR4 – 1GB
eMMC Flash – 16GB (Expandable)

OSM BGA Features:

  • RGMII x 1
  • USB2.0 x 2
  • SDIO x 1
  • QSPI x 1
  • SPI x 1
  • CAN x 1
  • I2C x 2


  • MIPI CSI x 1
  • MIPI DSI x 1 (Available only in G2LC SoC)
  • I2S x 1
  • UART x 3
  • PWM x 1
  • ADC x 2 (Available only in G2UL SoC)
  • GPIOs

OS Support:


General Features:

Power Input

5V, 2.5A through OSM BGA

Form Factor

30mm x 30mm

Operating Temperature

-40°C to +85°C

Environment Specification

REACH & RoHS3 Compliant


For any highly integrated OSM Modules, thermal design is very important factor. iWave Supports Heat Sink and Heat Spreader solution for Renesas G2UL or G2LC based OSM LGA Module.

OSM Based Pico ITX SBC


  • OSM based Pico ITX SBC
  • 1000/100/10 Mbps Ethernet
  • USB 2.0 OTG (micro AB Receptacle Connector) x 1
  • Debug UART Header x 1
  • Audio In & Out Jack through I2S Codec x 1
  • RS232 Header x 1 (without CTS/RTS)
  • MIPI Display (G2LC only)
  • MIPI CSI through MIPI CSI Connector


The Enclosure is essential for a SBC, iWave provides rugged Aluminum and metal enclosure options which keeps the device safe whilst maintaining full access to all the major ports.

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