Zynq UltraScale+ MPSoC ZU19/ZU17/ZU11

Zynq UltraScale+ MPSoC ZU19/ZU17/ZU11

iW-RainboW-G35M®

  • ZynqTM UltraScale+TM MPSoC family with FFVC1760 package
  • Compatible with ZU19/ZU17/ZU11 EG devices
  • 4GB DDR4 RAM for PS with ECC, 4GB DDR RAM for PS without ECC and Dual 4GB DDR4 RAM for PL
  • 8GB eMMC Flash (Expandable up to 128GB)
  • Up to 1143K Logic cells & 522K LUTs
  • 16 GTY Transceivers, 32 GTH Transceivers, 4 GTR Transceivers and 142 IOs

On Module Features:

SoC

ZU19/ZU17/ZU11 EG
Processing System (PS)

  • Quad/Dual Arm Cortex-A53 @1.5GHz, Dual Cortex-R5 @600MHz
  • Arm Mali-400MP2 GPU @677MHz

Programming Logic (PL)

  • Up to 1143K Logic cells & 522K LUTs
  • PL GTY High Speed Transceivers x 16 @32.75 Gbps
  • PL GTH High Speed Transceivers x 32 @16.375 Gbps
Memory

64bit, 4GB DDR4 RAM for PS with ECC (Expandable up to 8GB)
64bit, Dual 4GB DDR4 RAM for PL (Expandable up to 16GB)

Storage

8GB eMMC Flash (Expandable up to 128GB)

240pin High-Speed Board to Board Connector 1 Interfaces

From PS Block
  • PS GTR Transceiver Lanes x 2 (Up to 6.0Gb/s)
  • GEM3 RGMII Interface or ULPI Interface x 1
  • CAN interface x 2
From PL Block
  • High Speed GTH Transceiver Lanes x 12 (Up to 16.375Gbps)
  • HD Bank IOs – Up to 46 Single Ended IO’s
  • ADC Input pins- Up to 20 Single Ended IOs from HD Banks

240pin High-Speed Board to Board Connector 2 Interfaces

From PS Block
  • PS GTR Transceiver Lanes x 2 (Up to 6.0Gb/s)
  • Gigabit Ethernet x 1 Port (through On-SOM Gigabit Ethernet PHY)
  • USB2.0 OTG x 1 Port (through On-SOM USB2.0 transceiver)
  • SD (4bit) x 1
  • Debug UART & Data UART x 1
  • SPI x 1
  • I2C x 2 Port
  • JTAG x 1
From PL Block
  • High Speed GTH Transceiver Lanes x 4 (Up to 16.375Gbps)
  • HP Bank IOs – 48 LVDS/96 Single Ended IO’s
  • ADC Input pins – Up to 32 Differential/Single Ended from HP Banks

240pin High-Density Board to Board Connector 3 Interfaces

  • PL-GTY High Speed Transceivers (up to 32.75Gbps) x 16
  • PL-GTH High Speed Transceivers (up to 16.375Gbps) x 8

80pin High-Density Board to Board Connector 4 Interfaces

  • PL-GTH High Speed Transceivers (up to 16.375Gbps) x 8

Software Features

  • Multi OS Support: Linux, Ubuntu, VxWorks, PYNQ, Baremetal
  • Security: Secure boot, TPM, watchdog, multiboot
  • Docker & QEMU support
  • Dynamic FPGA configuration
  • Flexible boot options
  • BIST, 100G & video support

General Features:

Power Input

5V through B2B Connector2

Form Factor

75mm x 110mm (OREN+)

Operating Temperature

-40°C to +85°C (Industrial)

Environment Specification

REACH & RoHS3 Compliant

Compliance

CE*

* Under Progress

DEVELOPMENT KIT

ZU19/ZU17/ZU11 Zynq UltraScale+ SOM Dev Kit
  • 100G Ethernet though QSFP28/QSFP+ Connector
  • 112G FireFly Connector
  • 10G Ethernet through SFP+ Connector
  • 12G SDI Video IN through HD BNC Connector
  • 12G SDI Video OUT through HD BNC Connector
  • 4K HDMI 2.0 IN through HDMI Connector
  • 4K HDMI 2.0 OUT through HDMI Connector
  • Dual FMC High Pin Count (HPC) Connector
  • DP 1.2a Display Port Connector
  • PCIe Gen2 x4 & M.2 SATA 3.1 Connector
  • USB 3.0 OTG through TypeC Connector
  • Dual Gigabit Ethernet through RJ45MagJack
  • USB2.0 OTG through MicroAB Connector
  • Standard SD & Dual PMOD Connector
  • CAN Header & 20 Pin Header (for PS IOs)
  • Operating Temperature: -20°C to +85°C
  • Form Factor: 140mm x 170mm

Custom Design Sevices

iWave provides end-to-end ODM services, from concept to production, leveraging our in-house expertise in hardware design, software development, FPGA design, and mechanical enclosure design. The FPGA expertise at iWave includes RTL, high speed bus interface and transceivers, storage, video, networking, and high-speed ADC/DAC with the entire product lifecycle, from initial concept to mass production and ongoing support.

THERMAL SOLUTIONS

For any highly integrated System On Modules, thermal design is very important factor. iWave Supports Heat Sink and Fan Sink Solution for ZU19/17/11EG Zynq UltraScale+ MPSoC SOM.

PCIe Gen3 X8 FMC MODULE

iWave supports FMC Module for Zynq MPSoC Development Kit with PCIe Gen3 x8 Rootport/Endpoint Slot, M.2 PCIe (2lane) NVMe Connector, MIPI CSI Connector and MIPI DSI Connector..

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