Zynq UltraScale+ XQ MPSoC 19/11EG – MIL Grade

Zynq UltraScale+ XQ MPSoC 19/11EG – MIL Grade

iG-G35M-ML®®

  • XQ-Zynq™ UltraScale+™ MPSoC family with FFRC1760 package
  • Compatible with ZU19/ZU11 EG devices
  • 4GB DDR4 RAM for PS with ECC & Dual 4GB DDR4 RAM for PL
  • 32GB eMMC Flash (Expandable up to 128GB) & 256MB QSPI Flash
  • Up to 1143K Logic cells & 522K LUTs
  • 16 GTY Transceivers, 32 GTH Transceivers, 4 GTR Transceivers and 174 IOs

On Module Features:

MPSoC ZU19/ZU11 EG

Processing System (PS)

  • Quad/Dual Arm Cortex-A53 at 1.2GHz, Dual Cortex-R5 at 500MHz
  • Arm Mali-400MP2 GPU @600MHz

Programming Logic (PL)

  • Up to 1143K Logic cells and 522K LUTs
  • PL GTY High Speed Transceivers x16 at 28.2Gb/s
  • PL GTH High Speed Transceivers x32 at 16.3Gb/s
Memory & Storage
  • 64bit, 4GB DDR4 RAM for PS with ECC
  • 64bit, Dual 4GB DDR4 RAM for PL
  • 32GB eMMC Flash (Expandable up to 128GB)
  • 256MB QSPI
  • 2Kb EEPROM

Board to Board Connector1 Interfaces(400pin)

From PS Block
  • PS GTR Transceiver Lanes x 2 (Up to 6.0Gb/s)
  • GEM3 RGMII Interface or ULPI Interface x 1
  • CAN Interface x 2
From PL Block
  • High Speed GTH Transceiver Lanes x 12 (Up to 12.5Gbps)
  • HD Bank IOs – Up to 78 Single Ended IO’s
  • ADC Input pins- Up to 32 Single Ended IOs from HD Banks

240pin High-Speed Board to Board Connector 2 Interfaces

From PL Block

From PS Block

  • PS GTR Transceiver Lanes x 2 (Up to 6.0Gb/s)
  • Gigabit Ethernet x 1 Port (through On-SOM Gigabit Ethernet PHY)
  • SD (4bit) x 1
  • Debug UART and Data UART x 1
  • SPI x 1(Optional)
  • I2C x 2 Port
  • JTAG x 1
From PL Block
  • High Speed GTH Transceiver Lanes x 4 (Up to 12.5Gbps)
  • HD Bank IOs – Up to 48 LVDS/96 Single Ended IO’s
  • ADC Input pins – Up to 32 Differential/Single Ended HP Banks

240pin High-Density Board to Board Connector 3 Interfaces

  • PL-GTY High Speed Transceivers (up to 25.785Gbps) x 16
  • PL-GTH High Speed Transceivers (up to 12.5Gbps) x 8

80pin High-Density Board to Board Connector 4 Interfaces

PL-GTH High Speed Transceivers (up to 12.5Gbps) x 8

General Features

Power Input

5V through B2B Connector2

Form Factor

75mm x 110mm (OREN+)

BSP Support

Linux/Vivado 2024.2

Operating Temperature

-55°C to +125°C (Military)

Environment Specification

REACH & RoHS3 Compliant

Custom Design Sevices

iWave provides end-to-end ODM services, from concept to production, leveraging our in-house expertise in hardware design, software development, FPGA design, and mechanical enclosure design. The FPGA expertise at iWave includes RTL, high speed bus interface and transceivers, storage, video, networking, and high-speed ADC/DAC with the entire product lifecycle, from initial concept to mass production and ongoing support.

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