Zynq UltraScale+ RFSoC ZU67/ZU65/ZU64/ZU63DR

Zynq UltraScale+ RFSoC ZU67/ZU65/ZU64/ZU63DR

iG-RainboW-G79M®

  • Zynq™ Ultrascale™+ RFSoC family with FFVE1156 Package
  • Compatible with ZU67/ZU65/ZU64/ZU63DR devices
  • 8GB DDR4 RAM for PS with ECC & 4GB DDR4 RAM for PL
  • 32GB eMMC Flash Expandable up to 128GB & 256MB QSPI Flash
  • Integrated DFE IP Block
  • Up to 489K Logic cells & 223K LUTs

On Module Features:

SoC

RFSoC ZU67/ZU65/ZU64/ZU63DR
Processing System (PS)

  • Quad-core ARM Cortex-A53 MPCore up to 1.3GHz
  • Dual-core ARM Cortex-R5 MPCore up to 600MHz

Programming Logic (PL)

  • Up to 489K Logic cells & 223K LUTs
  • PL GTY High Speed Transceivers x 8 @28.21 Gbps
Memory
  • 64bit, 8GB DDR4 RAM for PS with ECC
  • 32bit, 4GB DDR4 RAM for PL
Storage
  • 32GB eMMC Flash Expandable up to 128GB
  • 256MB QSPI Flash

Board to Board Connector1 Interfaces (400pin)

ADC

8 x ADC Channels up to 2.95 GSPS and 2 x ADC Channels up to 5.9 GSPS

DAC

8 x DAC Channels up to 10 GSPS

PL IOs

HP Bank IOs – Up to 21 LVDS/42 SE

Board to Board Connector2 Interfaces (400pin)

From PL Block
  • 8 x PL-GTY High Speed Transceivers (up to 28.21Gbps)
From PS Block
  • Gigabit Ethernet x 1 Port (through On-SOM Gigabit Ethernet PHY)
  • USB 2.0 OTG x 1 (through On-SOM USB2.0 transceiver)
  • SPI/QSPI X 1 Port (Optional)
  • CAN x 1, I2C x 2, SD x 1
  • Debug UART x 1, Data UART x 1, PS JTAG
  • RGMII Interface or ULPI Interface x 1
  • PS -GTR High speed Transceivers x 4 (upto 6Gbps)
  • PS-Control Signals
Clock Signals
  • 10MHz Clock IN, 1 PPS IN
  • 10 MHz Clock out, 1 PPS Clock Out

General Features

Power Input

12V through B2B Connector2

Form Factor

82mm x 100mm (BRYNc)

BSP Support

Linux BSP- Yocto/Vivado 2025.2

Operating Temperature

-40°C to +85°C (Industrial)

Environment Specification

REACH & RoHS3 Compliant

Compliance

CE*

Custom Design Sevices

iWave provides end-to-end ODM services, from concept to production, leveraging our in-house expertise in hardware design, software development, FPGA design, and mechanical enclosure design. The FPGA expertise at iWave includes RTL, high speed bus interface and transceivers, storage, video, networking, and high-speed ADC/DAC with the entire product lifecycle, from initial concept to mass production and ongoing support.

THERMAL SOLUTIONS

For any highly integrated System on Modules, thermal design is very important factor. iWave Supports heat Spreader and Fan Sink solution for RFSoC based SOM.

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