Agilex 9 R17B Direct RF

Agilex 9 R17B Direct RF

iG-RainboW-G67M®

  • Agilex™ 9 SoC FPGA R17B Package – AGRW014 Device
  • 8GB DDR4 for HPS, 8GB DDR4 for FPGA
  • 32GB eMMC Flash and 128MB QSPI Flash
  • 16 x FGT transceivers up to 58Gbps PAM4
  • ADC x 4 & DAC x 4 with sampling rate up to 64Gsps
  • Up to 1,437,240 Logic elements

Agilex™ 9 R17B Direct RF Soc FPGA

CPU
  • Quad-core 64-bit ARM® Cortex®-A53 up to 1.4GHz
  • Up to 1,437,240 Logic elements
  • 16 x FGT Transceivers up to 58Gbps PAM4
  • ADC x 4 & DAC x 4 ; Sampling rate up to 64Gsps
Memory
  • HPS 72bit DDR4 (8GB)
  • FPGA 72bit DDR4 (8GB)
  • HPS 8bit eMMC (32GB Upgradable)
  • SDM QSPI Flash (1Gb Upgradable)
  • EEPROM (2Kb Upgradable)
On SOM Features
  • Gigabit Ethernet PHY x 1
  • USB2.0 OTG through On SOM PHY x 1
  • On Board Clock Generators
  • Boot Selection Switch x 1 (optional)

Board to Board Connector Interfaces

HPS/SDM Interfaces
  • RGMII Gigabit Ethernet x 1 Port (through On-SOM Gigabit Ethernet PHY)
  • USB2.0 OTG X 1 Port (through On -SOM USB PHY)
  • I2C Interface x 1
  • Debug UART x1
  • JTAG Interface x 1
HPS to FPGA Interfaces
  • H2F I2C x 1
FPGA Interfaces
  • General Purpose Transceivers x 16 (up to 58Gbps – PAM4)
  • FPGA IO’s (55LVDS/110SE)
RF Connector Interfaces
  • ADC x 4
  • DAC x 4

General Features

Power Input

12V through B2B Connector 2

Operating Temperature

-40°C to +85°C (Industrial)

Form Factor

82mm x 111mm

Environment Specification

REACH & RoHS3 Compliant

Custom Design Sevices

iWave provides end-to-end ODM services, from concept to production, leveraging our in-house expertise in hardware design, software development, FPGA design, and mechanical enclosure design. The FPGA expertise at iWave includes RTL, high speed bus interface and transceivers, storage, video, networking, and high-speed ADC/DAC with the entire product lifecycle, from initial concept to mass production and ongoing support.

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