Versal™ AI Edge/Prime 3U VPX Plug-in Module (Payload Profile)

Versal™ AI Edge/Prime 3U VPX Plug-in Module (Payload Profile)

iG-RainboW-G57V®

  • SOSA aligned Versa™l AI Edge/Prime 3U VPX board
  • Compatible with VE2302/2202/2102/2002/VM1102 Devices with SFVA784 package
  • One 64-bit, 4GB LPDDR4
  • Supports SOSA Aligned Payload profiles
  • IPMC with Arm® 32-bit Cortex®-M0+ CPU
  • ADC x4 & DAC x4 with sampling rate up to 1.6GSPS
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Versal™ AI Edge/Prime

SoC

Compatible with VE2302/2202/2102/2002/VM1102 Devices
Dual Arm Cortex- A72 and Dual Arm Cortex R5F
Up to 328K Logic cells and 150K LUTs

Memory & Storage

64bit, 4GB LPDDR4 from PS (Upgradable)
256MB QSPI Flash and 16GB eMMC Flash (Upgradable)

IPMC

Arm® 32-bit Cortex®-M0+ CPU up to 80 MHz
On chip 64KB of flash and 4KB of SRAM
One 12-bit 1.68-MSPS analog-to-digital converter (ADC)

VPX Front Panel features

  • Gigabit Ethernet Header
  • USB3.0 Type-C
  • 3-pin Debug UART Header
  • Display Port
  • ADC x4 & DAC x4; Sampling rate up to 1.6GSPS1

VPX On board features

  • On Board Clock Generators
  • Temperature Sensor x1
  • Elapse Counter x1
  • EEPROM x1

3U VPX Backplane

Connector – P0

Utility Plane

  • System Control Signals (GA[0:4], P, SYSRESET, NVMRO)
  • System Reference Clocks (REF_CLK, AUX_CLK)
  • IPMB-A, B & JTAG
  • Power Input (12V VDC, 3.3V_AUX)
Connector – P1A +P1B

Data Plane Port-01

  • DP01[3:0] – 40G Ethernet

System Control Signals (Maskable Reset, SysCON, GDiscrete)
Maintenance Port MP01 & MP02
Power Input (VBAT)

Connector – P2A

User defined Port

  • EP[8:15] – GPLVDS 8 lanes
Aperture Pattern J – P2B

MT Ferrule Module – MM12F – 12 Fibre ports
NanoRF -10

  • ADC x4 & DAC x4; Sampling rate up to 1.6GSPS1

Profile Specification

Profile

SLT3-PAY-1F1U1S1S1U1U4F1J-14.6.13-4

Module Profile as per AMPS

MODA3p-16.6.13-1-4-F2C-(E8-E7) (P3F – N, 16G2) (E7) (N-G2) [E12]

General Specification

Slot Pitch

1 inch Conduction Cooled

BSP Support

Linux

Environment Specification

RoHS & REACH Compliant

Custom Design Sevices

iWave provides end-to-end ODM services, from concept to production, leveraging our in-house expertise in hardware design, software development, FPGA design, and mechanical enclosure design. The FPGA expertise at iWave includes RTL, high speed bus interface and transceivers, storage, video, networking, and high-speed ADC/DAC with the entire product lifecycle, from initial concept to mass production and ongoing support.

THERMAL SOLUTIONS

Thermal design is a crucial factor for highly integrated System on Modules. iWave offers Heat Sink solutions for VersalTM AI Edge -based SoMs to ensure optimal thermal management.

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