iWave Japan      Welcome to iWave Systems

FPGA Heat Sink


Rs1.00

Overview

The 95mm x 75mm sized Heat Sink for iWave’s FPGA SOMs (Arria10 & Zynq Ultrascale+ MPSOC) are made up of Aluminium material and uses silicone elastomer as thermal gap pad between the CPU and the heat Sink. The heat sink is light weight and rugged which can be easily attached with the iWave’s FPGA system on modules.

fpga heat sink top

Mouse over the image for zoom

More Views

  • fpga heat sink top
  • fpga heat sink bottom
FPGA/SoC SOMs Heatsink  pricing
FPGA SOMs Heatsink Product Features Part Numbers
Arria10 SoC SOM module heatsink iW-HSKALU-CLASLR-CU02
Zynq Ultrascale+ MPSoC SOM module heatsink iW-HSKALU-CLASLR-CU03

Get a Quote

* Required Fields

Powered by WebForms