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FPGA Heat Sink



The 95mm x 75mm sized Heat Sink for iWave’s FPGA SOMs (Arria10 & Zynq Ultrascale+ MPSOC) are made up of Aluminium material and uses silicone elastomer as a thermal gap pad between the CPU and the Heat sink. The heat sink is lightweight and rugged which can be easily attached with the iWave’s FPGA system on modules.

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FPGA/SoC SOMs Heatsink  pricing
FPGA SOMs Heatsink Product Features Part Numbers
Arria10 SoC SOM module heatsink iW-HSKALU-CLASLR-CU02
Zynq Ultrascale+ MPSoC SOM module heatsink iW-HSKALU-CLASLR-CU03

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