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FPGA Heat Sink

fpga heat sink top

The 95mm x 75mm sized Heat Sink for iWave’s FPGA SOMs (Arria10 & Zynq Ultrascale+ MPSOC) are made up of Aluminium material and uses silicone elastomer as thermal gap pad between the CPU and the heat Sink. The heat sink is light weight and rugged which can be easily attached with the iWave’s FPGA system on modules.

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