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Thermal Solutions

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  • fpga heat sink top

    FPGA Heat Sink

    Rs1.00

    The 95mm x 75mm sized Heat Sink for iWave’s FPGA SOMs (Arria10 & Zynq Ultrascale+ MPSOC) are made up of Aluminium material and uses silicone elastomer as thermal gap pad between the CPU and the heat Sink. The heat sink is light weight and rugged which can be easily attached with the iWave’s FPGA system on modules.

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  • iWave SMARC Heat Sink top

    SMARC Heat Sink

    Rs1.00

    The 82mmx42mm sized Heat Sink for iWave’s SMARC (i.MX8M, i.MX8 QM, SD820) modules are made up of Aluminium material and uses silicone elastomer as thermal gap pad between the CPU and the heat sink. The heat sink is light weight and rugged which can be easily attached with the iWave’s Qseven system on modules.

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  • Qseven Heat Sink

    Qseven Heat Sink

    Rs1.00
    The 70mmx63mm sized Heat Sink for iWave’s Qseven (RZ/G1H, RZ/G1M/G1N, i.MX6, Cyclone V) modules are made up of Aluminium material and uses silicone elastomer as thermal gap pad between the CPU and the heat Sink. The heat sink is light weight and rugged which can be easily attached with the iWave’s Qseven system on modules.
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  • iWave SODIMM Heat Spreader

    SODIMM Heat Spreader

    Rs1.00
    The 67.5mmx30mm sized Heat Spreaders for iWave’s SODIMM (i.MX8M Mini/Nano, Zynq 7000, RZ/G1E, i.MX6) are made up of Aluminium material and uses silicone elastomer as thermal gap pad between the CPU and the heat spreader. The heat spreader is light weight and rugged which can be easily attached with the iWave’s Qseven system on modules.
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  • iWave SODIMM Heat Sink 1

    SODIMM Heat Sink

    Rs0.00
    The 67.5mmx31.5mm sized Heat Sink for iWave’s SODIMM (i.MX8M Mini/Nano, Zynq 7000, RZ/G1E, i.MX6) modules are made up of Aluminium material and uses silicone elastomer as thermal gap pad between the CPU and the heat Sink. The Heat Sink is light weight and rugged which can be easily attached with the iWave’s Qseven system on modules.
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  • Qseven Heat Spreader1

    Qseven Heat Spreader

    Rs0.00

    The 70mmx63mm sized Heat Spreaders for iWave’s Qseven (RZ/G1H, RZ/G1M/G1N, i.MX6, Cyclone V) modules are made up of Aluminium material and uses silicone elastomer as thermal gap pad between the CPU and the heat spreader. The heat spreader is light weight and rugged which can be easily attached with the iWave’s Qseven system on modules.

    Learn More

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