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System On Modules

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i.MX6 MXM System On Module

iMX6 MXM SOM

Not Recommended for New Designs

The i.MX6 MXM SOM is based on NXP’s i.MX6 Series Quad/Dual/Dual Lite/Solo core processor running at 1GHz.A single ruggedized MXM edge connector provides the carrier board interface to carry all the I/O signals to and from the MXM module. With 1080p HD decoding & encoding and 2D/3D graphics an enhanced and optimized user experience is achieved .The MXM connector pinouts are fully compatible with iWave i.MX53 MXM SOM.The i.MX6 MXM SOM has an additional expansion connector to bring out the special/extra features of i.MX6 Series Quad/Dual/DualLite/Solo core processor.

NXP Semiconductors - Our Technology Partner

i.MX6 Latest Updates

Not Recommended for new designs
 
 
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Cyclone V SoC System On Module

Cyclone V SoC System On Module

iWave Systems launching Altera's Cyclone V SX SoC based Qseven compatible module for the increased system performance..

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DaVinci DM8168 Qseven SOM

DM8168 Q7 SOM

iWave's DM8168 SOM is based on TI's DaVinci DM816x DSP+ARM Cortex-A8 Microprocessor for faster and more robust applications. With extreme system and peripheral integration, the DSP+ARM MPUs provide multiple high-performance interfaces, such as PCIe Gen2, HDMI 1.3, SATA2.0, Gigabit Ethernet and DDR3 interfaces.

The module is compatible to Qseven R1.20 ARM specification and features up to 1.2 GHz CPU, on-board DDR3 RAM, Nand Flash, Micro SD slot and JTAG headers.

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i.MX6ULL/ULZ SODIMM System On Module

NXP i.MX6ULL SOM Board

NXP i.MX6ULL based SODIMM SOM module integrates power efficient high performance ARM Cortex A7 CPU core operating up to 900MHz speed with Linux OS. This cost optimized i.MX6ULL board is ultra-compact in size and integrated with on-board PMIC, Flash, DDR3 and dual Ethernet PHY. The i.MX6ULL SOM is ideally suitable for the cost & power optimized general embedded and industrial applications.

NXP Semiconductors - Our Technology Partner

i.MX6 Latest Updates

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i.MX6 Qseven System On Module

i.MX6 PMIC Qseven System on Module

iW-RainboW-G15M is Freescale's i.MX6 based Qseven compatible CPU module for faster and multimedia focused applications..

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i.MX6 SODIMM System On Module

i.MX6

iWave's new i.MX6 based cost effective SOM is highly integrated yet ultra-compact form which can be utilized across wide applications..

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i.MX6 Ultra Lite SODIMM System On Module

i.MX6 Ultra Lite SODIMM SOM

iWave's i.MX6UL based SODIMM CPU module integrates power efficient high performance ARM Cortex A7

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SMARC Heat Sink

SMARC Heat Sink

The 82mmx42mm sized Heat Sink for iWave’s SMARC modules are made up of Aluminium material and uses silicone elastomer as thermal gap pad between the CPU and the heat sink. The heat sink is light weight and rugged which can be easily attached with the iWave’s Qseven system on modules.

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iWave specializes in accelerating design cycles with Modular approach of using System On Modules (SOM) and Carrier boards. The SOM modules have the advantage of advanced peripheral Integration, space-saving, quick time to market and great cost savings. These Embedded boards go by several names such as Computer On Modules or COMs, CPU Modules and ARM SOMs.

iWave offers various System On Modules (SOMs) conforming to the R2.0 Qseven / SODIMM / MXM / XMC standards. These SOM modules are based on various processors and are readily available to deploy in product designs:

iWave's SOM Modules are targeted for OEMs, ODMs and any high-end embedded product designers, who can adopt the design and bring out innovative and cost-effective products within a short period of time for various applications.

For each of the System On Modules, iWave provides Development Platforms (Evaluation Board) for quick software prototyping associated with the Board Support Packages (BSPs) especially for the Linux / Windows Embedded / Android / QNX / VxWorks / iTRON / Green Hills Software INTEGRITY operating systems (OS/RTOS) etc.

Advantages of our SOMs:

  • The modules are fully standard compatible OEM Modules
  • Available in Industrial & Automotive temperature grade, with long term availability and technical support
  • The BSP / device drivers are available with rich feature set for multiple RTOS environments with good documentation
  • The modules & BSPs are targeted and being used in multiple products already
  • Lower Risk. No complex PCB design and manufacturing overheads
  • Long term product life support
  • Technical & Customization support, even for the low volume segment