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System On Modules

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i.MX6 Qseven System On Module

i.MX6 PMIC Qseven System on Module

iW-RainboW-G15M is Freescale's i.MX6 based Qseven compatible CPU module for faster and multimedia focused applications..

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DaVinci DM8168 Qseven SOM

DM8168 Q7 SOM

iWave's DM8168 SOM is based on TI's DaVinci DM816x DSP+ARM Cortex-A8 Microprocessor for faster and more robust applications. With extreme system and peripheral integration, the DSP+ARM MPUs provide multiple high-performance interfaces, such as PCIe Gen2, HDMI 1.3, SATA2.0, Gigabit Ethernet and DDR3 interfaces.

The module is compatible to Qseven R1.20 ARM specification and features up to 1.2 GHz CPU, on-board DDR3 RAM, Nand Flash, Micro SD slot and JTAG headers.

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i.MX51 Qseven System On Module

i.MX51 Qseven SOM

iW-RainboW-G8M-Q7 (Qseven Compatible i.MX51 Module) is based on Freescale's i.MX51 multimedia application processor. The processor features advanced and power-efficient implementation of the ARM Cortex A8 core, which operates at speeds of 800 MHz. This module provides advanced peripheral integration, green energy efficient-power savings, reduced time to market. It can be used for any portable computing applications like Industrial Handheld, High-end PDAs, Advanced HMI, Secure Devices, Automotive Handhelds, Mobile Internet Devices, Wireless Medical Handheld devices, etc.This Qseven Rel.1.20 form factor allows space-saving hardware designs as well as quick and simple integration of the module into the target application.

NXP Semiconductors - Our Technology Partner

i.MX6 Latest Updates

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FPGA Radar Interface Card

FPGA Radar Interface Card

iWave radar interface card is designed around Lattice FPGA with the PMC/XMC Industry standard form factor.RIC is a high-performance, dual-channel radar interface board that accepts and processes analog and digital radar signals and provides a PCI express interface to applications.

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PPC MPC 864x XMC / PrPMC

PPC MPC 864x XMC / PrPMC

PPC MPC 864x XMC / PrPMC is NXP's Power Architecture technology processor MPC8640 based module with the PMC/XMC Industry standard form factor With its high speed interfaces.

NXP Semiconductors - Our Technology Partner

i.MX6 Latest Updates

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Cyclone V SoC System On Module

iWave Cyclone V SoC Q7 System On Module top

iWave Systems launching Altera's Cyclone V SX SoC based Qseven compatible module for the increased system performance..

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MXM Heat Spreader

iWave MXM Heat Spreader 1

The 85mmx70mm sized Heat Spreaders for iWave’s MXM modules are made up of Aluminium material and uses silicone elastomer as thermal gap pad between the CPU and the heat spreader. The heat spreader is light weight and rugged which can be easily attached with the iWave’s Qseven system on modules.

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i.MX6 SODIMM System On Module

iWave i.MX6 top

iWave's new i.MX6 based cost effective SOM is highly integrated yet ultra-compact form which can be utilized across wide applications..

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iWave specializes in accelerating design cycles with Modular approach of using System On Modules (SOM) and Carrier boards. The SOM modules have the advantage of advanced peripheral Integration, space-saving, quick time to market and great cost savings. These Embedded boards go by several names such as Computer On Modules or COMs, CPU Modules and ARM SOMs.

iWave offers various System On Modules (SOMs) conforming to the R2.0 Qseven / SODIMM / MXM / XMC standards. These SOM modules are based on various processors, ARM + FPGAs and are readily available to deploy in product designs:

iWave's SOM Modules are targeted for OEMs, ODMs and any high-end embedded product designers, who can adopt the design and bring out innovative and cost-effective products within a short period of time for various applications.

For each of the System On Modules, iWave provides Development Platforms (Evaluation Board) for quick software prototyping associated with the Board Support Packages (BSPs) especially for the Linux / Windows Embedded / Android / QNX / VxWorks / iTRON / Green Hills Software INTEGRITY operating systems (OS/RTOS) etc.

Advantages of our SOMs:

  • The modules are fully standard compatible OEM Modules
  • Available in Industrial & Automotive temperature grade, with long term availability and technical support
  • The BSP / device drivers are available with rich feature set for multiple RTOS environments with good documentation
  • The modules & BSPs are targeted and being used in multiple products already
  • Lower Risk. No complex PCB design and manufacturing overheads
  • Long term product life support
  • Technical & Customization support, even for the low volume segment