iWave Japan      Welcome to iWave Systems

System On Modules

Items 17 to 24 of 27 total

per page
Page:
  1. 1
  2. 2
  3. 3
  4. 4

List  Grid 

Set Descending Direction

RZ/G1E SODIMM System On Module

Renesas RZ/G1E SODIMM Module

iWave’s RZ/G1E based SODIMM system on module integrates power efficient ARM Cortex A7 Dual core CPU operating up to 1GHz speed and with 802.11n Wi-Fi & BLE4.0 Module. The SOM is packed with rich set of features and IO peripherals. It integrates HD hardware codecs, 3D Graphics Acceleration, DDR3 RAM, eMMC Flash, Gigabit and 10/100 Ethernet PHY. The SOM is ideally suitable for low power, cost effective, general embedded, industrial and video intensive applications.

View

RZ/G1M,G1N Qseven System On Module

RZ/G1M,G1N Qseven System On Module 1

RZ/G1M SOM supports Dual Core Cortex A15 CPU, USB3.0, Ethernet-AVB & rich Multi Media engine with for Full HD parallel encode/decode..

View

i.MX6 Ultra Lite SODIMM System On Module

i.MX6 Ultra Lite SODIMM SOM

iWave's i.MX6UL based SODIMM CPU module integrates power efficient high performance ARM Cortex A7

View

i.MX6 SODIMM System On Module

iWave i.MX6 top

iWave's new i.MX6 based cost effective SOM is highly integrated yet ultra-compact form which can be utilized across wide applications..

View

MXM Heat Spreader

iWave MXM Heat Spreader 1

The 85mmx70mm sized Heat Spreaders for iWave’s MXM modules are made up of Aluminium material and uses silicone elastomer as thermal gap pad between the CPU and the heat spreader. The heat spreader is light weight and rugged which can be easily attached with the iWave’s Qseven system on modules.

View

Cyclone V SoC System On Module

iWave Cyclone V SoC Q7 System On Module top

iWave Systems launching Altera's Cyclone V SX SoC based Qseven compatible module for the increased system performance..

View

PPC MPC 864x XMC / PrPMC

PPC MPC 864x XMC / PrPMC

PPC MPC 864x XMC / PrPMC is NXP's Power Architecture technology processor MPC8640 based module with the PMC/XMC Industry standard form factor With its high speed interfaces.

NXP Semiconductors - Our Technology Partner

i.MX6 Latest Updates

View

FPGA Radar Interface Card

FPGA Radar Interface Card

iWave radar interface card is designed around Lattice FPGA with the PMC/XMC Industry standard form factor.RIC is a high-performance, dual-channel radar interface board that accepts and processes analog and digital radar signals and provides a PCI express interface to applications.

View

Items 17 to 24 of 27 total

per page
Page:
  1. 1
  2. 2
  3. 3
  4. 4

List  Grid 

Set Descending Direction


iWave specializes in accelerating design cycles with Modular approach of using System On Modules (SOM) and Carrier boards. The SOM modules have the advantage of advanced peripheral Integration, space-saving, quick time to market and great cost savings. These Embedded boards go by several names such as Computer On Modules or COMs, CPU Modules and ARM SOMs.

iWave offers various System On Modules (SOMs) conforming to the R2.0 Qseven / SODIMM / MXM / XMC standards. These SOM modules are based on various processors, ARM + FPGAs and are readily available to deploy in product designs:

iWave's SOM Modules are targeted for OEMs, ODMs and any high-end embedded product designers, who can adopt the design and bring out innovative and cost-effective products within a short period of time for various applications.

For each of the System On Modules, iWave provides Development Platforms (Evaluation Board) for quick software prototyping associated with the Board Support Packages (BSPs) especially for the Linux / Windows Embedded / Android / QNX / VxWorks / iTRON / Green Hills Software INTEGRITY operating systems (OS/RTOS) etc.

Advantages of our SOMs:

  • The modules are fully standard compatible OEM Modules
  • Available in Industrial & Automotive temperature grade, with long term availability and technical support
  • The BSP / device drivers are available with rich feature set for multiple RTOS environments with good documentation
  • The modules & BSPs are targeted and being used in multiple products already
  • Lower Risk. No complex PCB design and manufacturing overheads
  • Long term product life support
  • Technical & Customization support, even for the low volume segment