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System On Modules

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i.MX8M Nano SODIMM SOM

i.MX8M Nano SODIMM SOM 1

The NXP i.MX8M Nano SODIMM System On Module featuring the NXP i.MX8M, will be the new addition to iWave's i.MX8 SOM portfolio. The i.MX8M Nano SODIMM System On Module is aimed to offer applications such as Digital Signage, Industrial HMI, Home Automation, Audio/Video Streaming devices, and General Embedded applications.

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ZU19/17/11 Zynq UltraScale+ MPSoC Type-7 COM Express

ZU19/17/11 Zynq UltraScale+ MPSoC Type-7 COM Express
iWave’s COM Express Compact Type 7 Server Class module is based Zynq UltraScale+ MPSoC EG ZU19/ZU17/ZU11 devices in C1760 package. MPSoC supports Quad Cortex A53 up to 1.5GHz with programmable logic elements up to 1 million. COMe supports high speed connectivity peripherals such as 10GBaseKR Ethernet, up to 28 lane PCIe, USB3.0, SATA3.1, Gigabit Ethernet. Furthermore, it supports 16 GTY Transceivers can support up to 32.75 Gbps speed over Firefly connector.
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FPGA Heat Sink

fpga heat sink top

The 95mm x 75mm sized Heat Sink for iWave’s FPGA SOMs (Arria10 & Zynq Ultrascale+ MPSOC) are made up of Aluminium material and uses silicone elastomer as thermal gap pad between the CPU and the heat Sink. The heat sink is light weight and rugged which can be easily attached with the iWave’s FPGA system on modules.

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ZU19/17/11 Zynq UltraScale+ MPSoC System On Module

iWave ZU19/17/11 Zynq Ul+ MPSoC SOM top

Xilinx Zynq UltraScale+ MPSoC based System On Module features the Zynq UltraScale+ MPSoC EG ZU11/ZU17/ZU19 devices with C1760 package. MPSoC supports Quad Cortex A53 up to 1.5GHz with programmable LEs up to 1 million. SOM supports high speed connectivity peripherals such as PCIe, USB3.0, SATA3.1, Display port, Gigabit Ethernet through GTR high speed transceivers from MPSoC. Furthermore, it supports 16 GTY Transceivers which can up to 32.75 Gbps to run demanding applications.

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SMARC Heat Sink

iWave SMARC Heat Sink top

The 82mmx42mm sized Heat Sink for iWave’s SMARC (i.MX8M, i.MX8 QM, SD820) modules are made up of Aluminium material and uses silicone elastomer as thermal gap pad between the CPU and the heat sink. The heat sink is light weight and rugged which can be easily attached with the iWave’s Qseven system on modules.

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i.MX8M Mini Q/QL/D/DL/S/SL SODIMM SOM

i.MX8M Mini/Nano SODIMM System On Module

The NXP i.MX8M Mini Q/QL/D/DL/S/SL SODIMM System On Module featuring the NXP i.MX8M, will be the new addition to iWave's i.MX8 SOM portfolio. The i.MX8M Mini SODIMM System On Module is aimed to offer applications such as Digital Signage, Industrial HMI, Home Automation, Audio/Video Streaming devices, and General Embedded applications.

NXP Semiconductors - Our Technology Partner

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ZU7/5/4 Zynq UltraScale+ MPSoC / FPGA SOM

iWave Zynq UltraScale+ SoC top

Xilinx Zynq UltraScale+ MPSoC based System On Module features the Xilinx..

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i.MX8M SMARC System On Module

i.MX8M SMARC System On Module front

The i.MX8M Quad, Quad Lite, Dual based SMARC System On Module integrates Quad/Dual Cortex A53 @ up to1.5GHz, H.265 4K60 decode, GC7000 Lite GPU, MIPI CSI/DSI, HDMI2.0 TX, USB3.0, PCIe2.0 with on SOM 10/100/1000 Mbps Ethernet PHY and IEEE 802.11 a/b/g/n/ac Wi-Fi & Bluetooth 5.0 module. The i.MX8M SMARC System On Module is aimed to offer applications such as Digital Media Adaptors, HD Digital signage, Industrial HMI, Building Automation, Imaging & Scanning, Audio/Video Streaming devices, and Machine Vision.

NXP Semiconductors - Our Technology Partner

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iWave specializes in accelerating design cycles with Modular approach of using System On Modules (SOM) and Carrier boards. The SOM modules have the advantage of advanced peripheral Integration, space-saving, quick time to market and great cost savings. These Embedded boards go by several names such as Computer On Modules or COMs, CPU Modules and ARM SOMs.

iWave offers various System On Modules (SOMs) conforming to the R2.0 Qseven / SODIMM / MXM / XMC standards. These SOM modules are based on various processors, ARM + FPGAs and are readily available to deploy in product designs:

iWave's SOM Modules are targeted for OEMs, ODMs and any high-end embedded product designers, who can adopt the design and bring out innovative and cost-effective products within a short period of time for various applications.

For each of the System On Modules, iWave provides Development Platforms (Evaluation Board) for quick software prototyping associated with the Board Support Packages (BSPs) especially for the Linux / Windows Embedded / Android / QNX / VxWorks / iTRON / Green Hills Software INTEGRITY operating systems (OS/RTOS) etc.

Advantages of our SOMs:

  • The modules are fully standard compatible OEM Modules
  • Available in Industrial & Automotive temperature grade, with long term availability and technical support
  • The BSP / device drivers are available with rich feature set for multiple RTOS environments with good documentation
  • The modules & BSPs are targeted and being used in multiple products already
  • Lower Risk. No complex PCB design and manufacturing overheads
  • Long term product life support
  • Technical & Customization support, even for the low volume segment