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i.MX6 SODIMM Bottom-min

i.MX 6 SODIMM SOM

i.MX 6 SODIMM SOM

iW-RainboW-G15M-SODIMM®

  • i.MX 6 Q/D/DL/S @1GHz/800MHz Arm Cortex-A9
  • 1GB DDR3 Expandable up to 4GB
  • 4GB eMMC Flash Expandable up to 128GB
  • Multi format HD 1080p encode & decode
  • 2D/3D Hardware Graphics Acceleration
  • 1000/100/10 Mbps Ethernet
  • Modular & Compact SODIMM Form Factor 67.6mm X 37mm
  • 10+ years of Product Longevity Program
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On Module Feature:

CPU

i.MX 6 Quad: 4 x Cortex-A9, GPU & VPU
i.MX 6 Dual: 2 x Cortex-A9, GPU & VPU
i.MX 6 Dual Lite: 2 x Cortex-A9, GPU & VPU
i.MX 6 Solo: 1 x Cortex-A9, GPU & VPU
Memory & Storage

1GB DDR3 expandable up to 4GB
512MB DDR3 for Solo SOM (Expandable up to 2GB)
4GB eMMC Flash expandable upto 128GB
SPI Flash – 2MB(Expandable)

Edge Connector Features:

  • PCIe x 1
  • USB2.0 HOST x 1
  • USB2.0 OTG x 1
  • Gigabit Ethernet x 1
  • UART x 3
  • 24bpp RGB LCD x 1
  • 8bit Camera CSI x 1
  • LVDS x 1
  • HDMI 1.4 x 1
  • 4bit SD x 1
  • I2S x 1
  • I2C x 2
  • PWM x 4
  • Debug UART x 1
  • JTAG x 1
  • SATA x 1 (Not available in DL and S CPUs)

OS Support

  • Linux 4.1.15
  • Android Nougat 7.1.1

General Features:

Power Input

3.3V, 4A through SODIMM EDGE Connector
Form Factor

67.6mm X 37mm
Operating Temperature

-40°C to +85°C (Industrial)
Environment Specification

REACH & RoHS3 Compliant

DEVELOPMENT KIT

  • Gigabit Ethernet Jack x1
  • USB 2.0 Host Type-A x2
  • USB 2.0 OTG Type-micro AB x1
  • Micro SD x1
  • USB Debug Port (Serial to USB conversion) x1
  • Data UART Header x1
  • CAN Port x 1
  • Mini PCIe slot x1
  • SATA x 1 (Not available in DL and S CPUs)
  • Audio In/Out Jack through I2S Codec x1
  • Parallel Camera support
  • HDMI x 1
  • LVDS x 1
  • JTAG Header x1
  • RTC with backup battery
BROCHURE
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THERMAL SOLUTIONS

Heatsink_Front
Heatspreader_Front

For any highly integrated System On Modules, thermal design is very important factor. iWave Supports Heat Sink and Heat Spreader Solution for i.MX 6 SODIMM SOM.

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DIGIKEY

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