iWave's Board Design Expertise

Embedded products - We offer solutions based in Embedded Controllers/DSP Board Development that includes Multilayer PCB Cadding & Fabrication through our business partners, FPGA Development for higher-end protocols and interfaces.

Bus based HW platforms - Services that bound to Standard bus based hardware development such as interface boards with PCI/CPCI/PMC/VME bus standards for Engineering/Integration.

Support and Maintenance - Technology Upgradation or Product Obsolescence are taken care for Boards Systems redesign for Processor, Technology, Bus or External interfaces.

PCB Cadding Capabilities:

• Turnkey PCB Layout / Layer stack up / Placement / Routing / Signal integrity
• No. of Layers: Worked on designs with no. of layers varying from 2 to 24
• Designs with pins pitch of 0.5mm, 0.65mm, 0.8mm, 1mm etc.
• Currently involved in a project with Processor of 0.4mm pitch
• High Speed designs involving DDR2 SDRAM, OC48, Pentium-M, Rocket IO (3.125 Gbps), USB High speed, Gigabit Ethernet, etc.
• RF Technology: WLAN & GPS Modules

In  House design Capabilities:

• Circuit Schematics Using Orcad Capture
• PCB Layout: Placement & Routing using Cadence Allegro
• Artwork / Gerber generation using Cadence Allegro
• Artwork review using GC Preview
• Signal Integrity Analysis using Hyperlynx
• PCB Layer Stack up preparation using Hyperlynx & Polar
• Other tools support through our partners

PCB Fabrication:

• iWave takes the complete turnkey development responsibility including the PCB fabrication
• PCB Fab. through our Partner companies like Hi-Q Electronics, etc.
• Boards Fabricated with 0.5mm pitch BGA’s
• Boards with 16 layer & size 18 inch x 18 inch
• Normal Time Frame for fab. is from 7 to 14 working days
• Fabrication with Impedance control (100/50 ohms, etc.), as an option
• Minimum Via size of 14 mil pad & 8 mil drill
• Minimum trace width of 3 mil with 3 mil separation

PCB Assembly:

• iWave takes the complete turnkey hardware development responsibility including the components procurement and PCB assembly
• PCB Assembly will be done through our Partners
• Boards Assembled with 0.5mm pitch BGA’s & 0201 package discrete components
• Assembly done for both Through-hole & SMT Technology

Components Procurement:

• In house Procurement/Logistics team
• 100% EOU option, under CSEZ scheme Turnkey manufacturing for Qty. from 5 to 1000+ for a single design
• 100% Components Procurement by the the in-house team

Hardware Testing & Certification:

• In-house: Full functional testing
• With all the required test facilities
• External approved labs
• Environment testing for the temperature, Humidity control Vibration
• Pre-compliance EMI / EMC
• Facilities in Bangalore / Chennai
• Underwriters Laboratories (UL) facility in Bangalore

For further details, contact mktg@iwavesystems.com